Global Flip Chip CSP Market

Flip Chip CSP Comprehensive Study by Application (Backlighting Unit (BLU), General Lighting, Automotive, Flash Lighting, Others), Category (Flip Chip Ball Grid Array (BGA), Wafer-Level Package (WLP), Advanced Semiconductor Engineering (ASE)) Players and Region - Global Market Outlook to 2026

Flip Chip CSP Market by XX Submarkets | Forecast Years 2022-2027  

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  • Summary
  • Market Segments
  • Table of Content
  • List of Table & Figures
  • Players Profiled
Flip Chip CSP Market Scope
The relevance of flip chip (FC) technology for a range of applications based on flip chip on board or flip chip in package is growing. The requirement for enhanced speed and performance, as well as a higher I/O count, was the initial impetus for the development of this technology. However, owing to cost savings, the adoption of a flip chip will be a game changer. Low-cost bumping techniques must be used in conjunction with an SMT-compatible assembly process to achieve this goal. Traditional LEDs are generally packed after the chip/die manufacturing process, with the die being connected to an interposer such as a ceramic substrate, resulting in a packaged LED, also known as an LED package. Separate processes of having produced chips go through a packing line are removed in the case of CSP LED since the chips are singulated and coated with phosphor at the die-level.

The Flip Chip CSP market study is segmented, by Application (Backlighting Unit (BLU), General Lighting, Automotive, Flash Lighting and Others) and major geographies with country level break-up.

The global market is highly competitive and consists of a limited number of providers who compete with each other. The intense competition, changing consumer spending patterns, demographic trends, and frequent changes in consumer preferences pose significant opportunities for market growth. Research Analyst at AMA estimates that South Korean Manufacturers will contribute to the maximum growth of Global Flip Chip CSP market throughout the predicted period.

Lumileds (Netherlands), Samsung (South Korea), Seoul Semiconductor (South Korea), LG Innotek (South Korea), OSRAM Opto Semiconductors GmbH (Germany), CAPLINQ Corporation (Netherlands), EPISTAR (Taiwan), Cree (United States), Genesis Photonics (Taiwan) and Lumens (South Korea) are some of the key players that are part of study coverage. Additionally, the Manufacturers which are also part of the research are Amkor Technology (United States), Maxim Integrated (United States), Korea Circuit Co.,Ltd. (South Korea) and Nichia (Japan).

About Approach
The research aims to propose a patent-based approach in searching for potential technology partners as a supporting tool for enabling open innovation. The study also proposes a systematic searching process of technology partners as a
preliminary step to select the emerging and key players that are involved in implementing market estimations. While patent analysis is employed to overcome the aforementioned data- and process-related limitations, as expenses occurred in that technology allows us to estimate the market size by evolving segments as target market from total available market.

Segmentation Overview
AMA Research has segmented the market of Global Flip Chip CSP market by Type, Application and Region.

On the basis of geography, the market of Flip Chip CSP has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico).

On 19th November, 2019 - Harvatek Introduced its CSP LED Product with Flip Chip Technology. The New LED Has a High Brightness and Low Power Dissipation, And There Is No Wire Bonding, Thus Processing Time Is Reduced. It also Has High Package Density with A Thickness of 0.15mm Which Is Thinner Than Most LED Products. and On 22nd July, 2019 - Lumileds Launched Chip Scale Package (CSP) with Directional CSPs for Smallest, Brightest Spotlights. The LUXEON CSP HL1 Offers the Greatest Lumen Density in A Small Chip Size Device, Allowing for Smaller Spotlights with Enough of Punch and Clever Colour Adjustment.


Market Trend
  • Emergence of Advance Flip Chip CSP

Market Drivers
  • Cost Efficiency Due to Omission
  • Properties Including Low Thermal Resistance & Uniform Current Spreading
  • Increasing R&D in LED Technology

Opportunities
  • Increasing Industrial Adoption of Flip Chip CSP

Restraints
  • Lack of Trained Professionals
  • Technological Limitations

Challenges
  • Fierce Competitive Pressure


Key Target Audience
Flip Chip CSP Manufactures, New Entrants and Investors, Flip Chip CSP Distributors and Suppliers, Venture Capitalists, Government Bodies, Corporate Entities, Government and Private Research Organizations and Others

Report Objectives / Segmentation Covered

By Application
  • Backlighting Unit (BLU)
  • General Lighting
  • Automotive
  • Flash Lighting
  • Others
By Category
  • Flip Chip Ball Grid Array (BGA)
  • Wafer-Level Package (WLP)
  • Advanced Semiconductor Engineering (ASE)

By Regions
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Taiwan
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • Italy
    • United Kingdom
    • Netherlands
    • Rest of Europe
  • MEA
    • Middle East
    • Africa
  • North America
    • United States
    • Canada
    • Mexico
  • 1. Market Overview
    • 1.1. Introduction
    • 1.2. Scope/Objective of the Study
      • 1.2.1. Research Objective
  • 2. Executive Summary
    • 2.1. Introduction
  • 3. Market Dynamics
    • 3.1. Introduction
    • 3.2. Market Drivers
      • 3.2.1. Cost Efficiency Due to Omission
      • 3.2.2. Properties Including Low Thermal Resistance & Uniform Current Spreading
      • 3.2.3. Increasing R&D in LED Technology
    • 3.3. Market Challenges
      • 3.3.1. Fierce Competitive Pressure
    • 3.4. Market Trends
      • 3.4.1. Emergence of Advance Flip Chip CSP
  • 4. Market Factor Analysis
    • 4.1. Porters Five Forces
    • 4.2. Supply/Value Chain
    • 4.3. PESTEL analysis
    • 4.4. Market Entropy
    • 4.5. Patent/Trademark Analysis
  • 5. Global Flip Chip CSP, by Application, Category and Region (value) (2015-2020)
    • 5.1. Introduction
    • 5.2. Global Flip Chip CSP (Value)
      • 5.2.1. Global Flip Chip CSP by: Application (Value)
        • 5.2.1.1. Backlighting Unit (BLU)
        • 5.2.1.2. General Lighting
        • 5.2.1.3. Automotive
        • 5.2.1.4. Flash Lighting
        • 5.2.1.5. Others
      • 5.2.2. Global Flip Chip CSP by: Category (Value)
        • 5.2.2.1. Flip Chip Ball Grid Array (BGA)
        • 5.2.2.2. Wafer-Level Package (WLP)
        • 5.2.2.3. Advanced Semiconductor Engineering (ASE)
      • 5.2.3. Global Flip Chip CSP Region
        • 5.2.3.1. South America
          • 5.2.3.1.1. Brazil
          • 5.2.3.1.2. Argentina
          • 5.2.3.1.3. Rest of South America
        • 5.2.3.2. Asia Pacific
          • 5.2.3.2.1. China
          • 5.2.3.2.2. Japan
          • 5.2.3.2.3. India
          • 5.2.3.2.4. South Korea
          • 5.2.3.2.5. Taiwan
          • 5.2.3.2.6. Australia
          • 5.2.3.2.7. Rest of Asia-Pacific
        • 5.2.3.3. Europe
          • 5.2.3.3.1. Germany
          • 5.2.3.3.2. France
          • 5.2.3.3.3. Italy
          • 5.2.3.3.4. United Kingdom
          • 5.2.3.3.5. Netherlands
          • 5.2.3.3.6. Rest of Europe
        • 5.2.3.4. MEA
          • 5.2.3.4.1. Middle East
          • 5.2.3.4.2. Africa
        • 5.2.3.5. North America
          • 5.2.3.5.1. United States
          • 5.2.3.5.2. Canada
          • 5.2.3.5.3. Mexico
  • 6. Flip Chip CSP: Manufacturers/Players Analysis
    • 6.1. Competitive Landscape
      • 6.1.1. Market Share Analysis
        • 6.1.1.1. Top 3
        • 6.1.1.2. Top 5
    • 6.2. Peer Group Analysis (2020)
    • 6.3. BCG Matrix
    • 6.4. Company Profile
      • 6.4.1. Lumileds (Netherlands)
        • 6.4.1.1. Business Overview
        • 6.4.1.2. Products/Services Offerings
        • 6.4.1.3. Financial Analysis
        • 6.4.1.4. SWOT Analysis
      • 6.4.2. Samsung (South Korea)
        • 6.4.2.1. Business Overview
        • 6.4.2.2. Products/Services Offerings
        • 6.4.2.3. Financial Analysis
        • 6.4.2.4. SWOT Analysis
      • 6.4.3. Seoul Semiconductor (South Korea)
        • 6.4.3.1. Business Overview
        • 6.4.3.2. Products/Services Offerings
        • 6.4.3.3. Financial Analysis
        • 6.4.3.4. SWOT Analysis
      • 6.4.4. LG Innotek (South Korea)
        • 6.4.4.1. Business Overview
        • 6.4.4.2. Products/Services Offerings
        • 6.4.4.3. Financial Analysis
        • 6.4.4.4. SWOT Analysis
      • 6.4.5. OSRAM Opto Semiconductors GmbH (Germany)
        • 6.4.5.1. Business Overview
        • 6.4.5.2. Products/Services Offerings
        • 6.4.5.3. Financial Analysis
        • 6.4.5.4. SWOT Analysis
      • 6.4.6. CAPLINQ Corporation (Netherlands)
        • 6.4.6.1. Business Overview
        • 6.4.6.2. Products/Services Offerings
        • 6.4.6.3. Financial Analysis
        • 6.4.6.4. SWOT Analysis
      • 6.4.7. EPISTAR (Taiwan)
        • 6.4.7.1. Business Overview
        • 6.4.7.2. Products/Services Offerings
        • 6.4.7.3. Financial Analysis
        • 6.4.7.4. SWOT Analysis
      • 6.4.8. Cree (United States)
        • 6.4.8.1. Business Overview
        • 6.4.8.2. Products/Services Offerings
        • 6.4.8.3. Financial Analysis
        • 6.4.8.4. SWOT Analysis
      • 6.4.9. Genesis Photonics (Taiwan)
        • 6.4.9.1. Business Overview
        • 6.4.9.2. Products/Services Offerings
        • 6.4.9.3. Financial Analysis
        • 6.4.9.4. SWOT Analysis
      • 6.4.10. Lumens (South Korea)
        • 6.4.10.1. Business Overview
        • 6.4.10.2. Products/Services Offerings
        • 6.4.10.3. Financial Analysis
        • 6.4.10.4. SWOT Analysis
  • 7. Global Flip Chip CSP Sale, by Application, Category and Region (value) (2021-2026)
    • 7.1. Introduction
    • 7.2. Global Flip Chip CSP (Value)
      • 7.2.1. Global Flip Chip CSP by: Application (Value)
        • 7.2.1.1. Backlighting Unit (BLU)
        • 7.2.1.2. General Lighting
        • 7.2.1.3. Automotive
        • 7.2.1.4. Flash Lighting
        • 7.2.1.5. Others
      • 7.2.2. Global Flip Chip CSP by: Category (Value)
        • 7.2.2.1. Flip Chip Ball Grid Array (BGA)
        • 7.2.2.2. Wafer-Level Package (WLP)
        • 7.2.2.3. Advanced Semiconductor Engineering (ASE)
      • 7.2.3. Global Flip Chip CSP Region
        • 7.2.3.1. South America
          • 7.2.3.1.1. Brazil
          • 7.2.3.1.2. Argentina
          • 7.2.3.1.3. Rest of South America
        • 7.2.3.2. Asia Pacific
          • 7.2.3.2.1. China
          • 7.2.3.2.2. Japan
          • 7.2.3.2.3. India
          • 7.2.3.2.4. South Korea
          • 7.2.3.2.5. Taiwan
          • 7.2.3.2.6. Australia
          • 7.2.3.2.7. Rest of Asia-Pacific
        • 7.2.3.3. Europe
          • 7.2.3.3.1. Germany
          • 7.2.3.3.2. France
          • 7.2.3.3.3. Italy
          • 7.2.3.3.4. United Kingdom
          • 7.2.3.3.5. Netherlands
          • 7.2.3.3.6. Rest of Europe
        • 7.2.3.4. MEA
          • 7.2.3.4.1. Middle East
          • 7.2.3.4.2. Africa
        • 7.2.3.5. North America
          • 7.2.3.5.1. United States
          • 7.2.3.5.2. Canada
          • 7.2.3.5.3. Mexico
  • 8. Appendix
    • 8.1. Acronyms
  • 9. Methodology and Data Source
    • 9.1. Methodology/Research Approach
      • 9.1.1. Research Programs/Design
      • 9.1.2. Market Size Estimation
      • 9.1.3. Market Breakdown and Data Triangulation
    • 9.2. Data Source
      • 9.2.1. Secondary Sources
      • 9.2.2. Primary Sources
    • 9.3. Disclaimer
List of Tables
  • Table 1. Flip Chip CSP: by Application(USD Million)
  • Table 2. Flip Chip CSP Backlighting Unit (BLU) , by Region USD Million (2015-2020)
  • Table 3. Flip Chip CSP General Lighting , by Region USD Million (2015-2020)
  • Table 4. Flip Chip CSP Automotive , by Region USD Million (2015-2020)
  • Table 5. Flip Chip CSP Flash Lighting , by Region USD Million (2015-2020)
  • Table 6. Flip Chip CSP Others , by Region USD Million (2015-2020)
  • Table 7. Flip Chip CSP: by Category(USD Million)
  • Table 8. Flip Chip CSP Flip Chip Ball Grid Array (BGA) , by Region USD Million (2015-2020)
  • Table 9. Flip Chip CSP Wafer-Level Package (WLP) , by Region USD Million (2015-2020)
  • Table 10. Flip Chip CSP Advanced Semiconductor Engineering (ASE) , by Region USD Million (2015-2020)
  • Table 11. South America Flip Chip CSP, by Country USD Million (2015-2020)
  • Table 12. South America Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 13. South America Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 14. Brazil Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 15. Brazil Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 16. Argentina Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 17. Argentina Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 18. Rest of South America Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 19. Rest of South America Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 20. Asia Pacific Flip Chip CSP, by Country USD Million (2015-2020)
  • Table 21. Asia Pacific Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 22. Asia Pacific Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 23. China Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 24. China Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 25. Japan Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 26. Japan Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 27. India Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 28. India Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 29. South Korea Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 30. South Korea Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 31. Taiwan Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 32. Taiwan Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 33. Australia Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 34. Australia Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 35. Rest of Asia-Pacific Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 36. Rest of Asia-Pacific Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 37. Europe Flip Chip CSP, by Country USD Million (2015-2020)
  • Table 38. Europe Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 39. Europe Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 40. Germany Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 41. Germany Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 42. France Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 43. France Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 44. Italy Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 45. Italy Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 46. United Kingdom Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 47. United Kingdom Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 48. Netherlands Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 49. Netherlands Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 50. Rest of Europe Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 51. Rest of Europe Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 52. MEA Flip Chip CSP, by Country USD Million (2015-2020)
  • Table 53. MEA Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 54. MEA Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 55. Middle East Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 56. Middle East Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 57. Africa Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 58. Africa Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 59. North America Flip Chip CSP, by Country USD Million (2015-2020)
  • Table 60. North America Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 61. North America Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 62. United States Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 63. United States Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 64. Canada Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 65. Canada Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 66. Mexico Flip Chip CSP, by Application USD Million (2015-2020)
  • Table 67. Mexico Flip Chip CSP, by Category USD Million (2015-2020)
  • Table 68. Company Basic Information, Sales Area and Its Competitors
  • Table 69. Company Basic Information, Sales Area and Its Competitors
  • Table 70. Company Basic Information, Sales Area and Its Competitors
  • Table 71. Company Basic Information, Sales Area and Its Competitors
  • Table 72. Company Basic Information, Sales Area and Its Competitors
  • Table 73. Company Basic Information, Sales Area and Its Competitors
  • Table 74. Company Basic Information, Sales Area and Its Competitors
  • Table 75. Company Basic Information, Sales Area and Its Competitors
  • Table 76. Company Basic Information, Sales Area and Its Competitors
  • Table 77. Company Basic Information, Sales Area and Its Competitors
  • Table 78. Flip Chip CSP: by Application(USD Million)
  • Table 79. Flip Chip CSP Backlighting Unit (BLU) , by Region USD Million (2021-2026)
  • Table 80. Flip Chip CSP General Lighting , by Region USD Million (2021-2026)
  • Table 81. Flip Chip CSP Automotive , by Region USD Million (2021-2026)
  • Table 82. Flip Chip CSP Flash Lighting , by Region USD Million (2021-2026)
  • Table 83. Flip Chip CSP Others , by Region USD Million (2021-2026)
  • Table 84. Flip Chip CSP: by Category(USD Million)
  • Table 85. Flip Chip CSP Flip Chip Ball Grid Array (BGA) , by Region USD Million (2021-2026)
  • Table 86. Flip Chip CSP Wafer-Level Package (WLP) , by Region USD Million (2021-2026)
  • Table 87. Flip Chip CSP Advanced Semiconductor Engineering (ASE) , by Region USD Million (2021-2026)
  • Table 88. South America Flip Chip CSP, by Country USD Million (2021-2026)
  • Table 89. South America Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 90. South America Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 91. Brazil Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 92. Brazil Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 93. Argentina Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 94. Argentina Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 95. Rest of South America Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 96. Rest of South America Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 97. Asia Pacific Flip Chip CSP, by Country USD Million (2021-2026)
  • Table 98. Asia Pacific Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 99. Asia Pacific Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 100. China Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 101. China Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 102. Japan Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 103. Japan Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 104. India Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 105. India Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 106. South Korea Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 107. South Korea Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 108. Taiwan Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 109. Taiwan Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 110. Australia Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 111. Australia Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 112. Rest of Asia-Pacific Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 113. Rest of Asia-Pacific Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 114. Europe Flip Chip CSP, by Country USD Million (2021-2026)
  • Table 115. Europe Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 116. Europe Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 117. Germany Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 118. Germany Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 119. France Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 120. France Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 121. Italy Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 122. Italy Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 123. United Kingdom Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 124. United Kingdom Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 125. Netherlands Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 126. Netherlands Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 127. Rest of Europe Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 128. Rest of Europe Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 129. MEA Flip Chip CSP, by Country USD Million (2021-2026)
  • Table 130. MEA Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 131. MEA Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 132. Middle East Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 133. Middle East Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 134. Africa Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 135. Africa Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 136. North America Flip Chip CSP, by Country USD Million (2021-2026)
  • Table 137. North America Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 138. North America Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 139. United States Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 140. United States Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 141. Canada Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 142. Canada Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 143. Mexico Flip Chip CSP, by Application USD Million (2021-2026)
  • Table 144. Mexico Flip Chip CSP, by Category USD Million (2021-2026)
  • Table 145. Research Programs/Design for This Report
  • Table 146. Key Data Information from Secondary Sources
  • Table 147. Key Data Information from Primary Sources
List of Figures
  • Figure 1. Porters Five Forces
  • Figure 2. Supply/Value Chain
  • Figure 3. PESTEL analysis
  • Figure 4. Global Flip Chip CSP: by Application USD Million (2015-2020)
  • Figure 5. Global Flip Chip CSP: by Category USD Million (2015-2020)
  • Figure 6. South America Flip Chip CSP Share (%), by Country
  • Figure 7. Asia Pacific Flip Chip CSP Share (%), by Country
  • Figure 8. Europe Flip Chip CSP Share (%), by Country
  • Figure 9. MEA Flip Chip CSP Share (%), by Country
  • Figure 10. North America Flip Chip CSP Share (%), by Country
  • Figure 11. Global Flip Chip CSP share by Players 2020 (%)
  • Figure 12. Global Flip Chip CSP share by Players (Top 3) 2020(%)
  • Figure 13. Global Flip Chip CSP share by Players (Top 5) 2020(%)
  • Figure 14. BCG Matrix for key Companies
  • Figure 15. Lumileds (Netherlands) Revenue, Net Income and Gross profit
  • Figure 16. Lumileds (Netherlands) Revenue: by Geography 2020
  • Figure 17. Samsung (South Korea) Revenue, Net Income and Gross profit
  • Figure 18. Samsung (South Korea) Revenue: by Geography 2020
  • Figure 19. Seoul Semiconductor (South Korea) Revenue, Net Income and Gross profit
  • Figure 20. Seoul Semiconductor (South Korea) Revenue: by Geography 2020
  • Figure 21. LG Innotek (South Korea) Revenue, Net Income and Gross profit
  • Figure 22. LG Innotek (South Korea) Revenue: by Geography 2020
  • Figure 23. OSRAM Opto Semiconductors GmbH (Germany) Revenue, Net Income and Gross profit
  • Figure 24. OSRAM Opto Semiconductors GmbH (Germany) Revenue: by Geography 2020
  • Figure 25. CAPLINQ Corporation (Netherlands) Revenue, Net Income and Gross profit
  • Figure 26. CAPLINQ Corporation (Netherlands) Revenue: by Geography 2020
  • Figure 27. EPISTAR (Taiwan) Revenue, Net Income and Gross profit
  • Figure 28. EPISTAR (Taiwan) Revenue: by Geography 2020
  • Figure 29. Cree (United States) Revenue, Net Income and Gross profit
  • Figure 30. Cree (United States) Revenue: by Geography 2020
  • Figure 31. Genesis Photonics (Taiwan) Revenue, Net Income and Gross profit
  • Figure 32. Genesis Photonics (Taiwan) Revenue: by Geography 2020
  • Figure 33. Lumens (South Korea) Revenue, Net Income and Gross profit
  • Figure 34. Lumens (South Korea) Revenue: by Geography 2020
  • Figure 35. Global Flip Chip CSP: by Application USD Million (2021-2026)
  • Figure 36. Global Flip Chip CSP: by Category USD Million (2021-2026)
  • Figure 37. South America Flip Chip CSP Share (%), by Country
  • Figure 38. Asia Pacific Flip Chip CSP Share (%), by Country
  • Figure 39. Europe Flip Chip CSP Share (%), by Country
  • Figure 40. MEA Flip Chip CSP Share (%), by Country
  • Figure 41. North America Flip Chip CSP Share (%), by Country
List of companies from research coverage that are profiled in the study
  • Lumileds (Netherlands)
  • Samsung (South Korea)
  • Seoul Semiconductor (South Korea)
  • LG Innotek (South Korea)
  • OSRAM Opto Semiconductors GmbH (Germany)
  • CAPLINQ Corporation (Netherlands)
  • EPISTAR (Taiwan)
  • Cree (United States)
  • Genesis Photonics (Taiwan)
  • Lumens (South Korea)
Additional players considered in the study are as follows:
Amkor Technology (United States) , Maxim Integrated (United States) , Korea Circuit Co.,Ltd. (South Korea) , Nichia (Japan)
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Jun 2021 240 Pages 55 Tables Base Year: 2021 Coverage: 15+ Companies; 18 Countries

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Global Flip Chip CSP Market Quantitative research analysis
Global Flip Chip CSP Market Qualitative Industry Analysis
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