Flip Chip CSP Market Scope
The relevance of flip chip (FC) technology for a range of applications based on flip chip on board or flip chip in package is growing. The requirement for enhanced speed and performance, as well as a higher I/O count, was the initial impetus for the development of this technology. However, owing to cost savings, the adoption of a flip chip will be a game changer. Low-cost bumping techniques must be used in conjunction with an SMT-compatible assembly process to achieve this goal. Traditional LEDs are generally packed after the chip/die manufacturing process, with the die being connected to an interposer such as a ceramic substrate, resulting in a packaged LED, also known as an LED package. Separate processes of having produced chips go through a packing line are removed in the case of CSP LED since the chips are singulated and coated with phosphor at the die-level.
The Flip Chip CSP market study is segmented, by Application (Backlighting Unit (BLU), General Lighting, Automotive, Flash Lighting and Others) and major geographies with country level break-up.
The global market is highly competitive and consists of a limited number of providers who compete with each other. The intense competition, changing consumer spending patterns, demographic trends, and frequent changes in consumer preferences pose significant opportunities for market growth. Research Analyst at AMA estimates that South Korean Manufacturers will contribute to the maximum growth of Global Flip Chip CSP market throughout the predicted period.
Lumileds (Netherlands), Samsung (South Korea), Seoul Semiconductor (South Korea), LG Innotek (South Korea), OSRAM Opto Semiconductors GmbH (Germany), CAPLINQ Corporation (Netherlands), EPISTAR (Taiwan), Cree (United States), Genesis Photonics (Taiwan) and Lumens (South Korea) are some of the key players that are part of study coverage. Additionally, the Manufacturers which are also part of the research are Amkor Technology (United States), Maxim Integrated (United States), Korea Circuit Co.,Ltd. (South Korea) and Nichia (Japan).
The research aims to propose a patent-based approach in searching for potential technology partners as a supporting tool for enabling open innovation. The study also proposes a systematic searching process of technology partners as a
preliminary step to select the emerging and key players that are involved in implementing market estimations. While patent analysis is employed to overcome the aforementioned data- and process-related limitations, as expenses occurred in that technology allows us to estimate the market size by evolving segments as target market from total available market.
AMA Research has segmented the market of Global Flip Chip CSP market by Type, Application and Region.
On the basis of geography, the market of Flip Chip CSP has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico).
On 19th November, 2019 - Harvatek Introduced its CSP LED Product with Flip Chip Technology. The New LED Has a High Brightness and Low Power Dissipation, And There Is No Wire Bonding, Thus Processing Time Is Reduced. It also Has High Package Density with A Thickness of 0.15mm Which Is Thinner Than Most LED Products. and On 22nd July, 2019 - Lumileds Launched Chip Scale Package (CSP) with Directional CSPs for Smallest, Brightest Spotlights. The LUXEON CSP HL1 Offers the Greatest Lumen Density in A Small Chip Size Device, Allowing for Smaller Spotlights with Enough of Punch and Clever Colour Adjustment.
- Emergence of Advance Flip Chip CSP
- Cost Efficiency Due to Omission
- Properties Including Low Thermal Resistance & Uniform Current Spreading
- Increasing R&D in LED Technology
- Increasing Industrial Adoption of Flip Chip CSP
- Lack of Trained Professionals
- Technological Limitations
- Fierce Competitive Pressure
Key Target AudienceFlip Chip CSP Manufactures, New Entrants and Investors, Flip Chip CSP Distributors and Suppliers, Venture Capitalists, Government Bodies, Corporate Entities, Government and Private Research Organizations and Others
Frequently Asked Questions (FAQ):
1. Is it possible to have certain customization in the study?
The Study can be customized to meet your requirements. Please connect with our representative, who will ensure you get a study that suits your business objectives.
2. How big is the Flip Chip CSP Market?
Yes, the study does represent market size by key business segment, application/end users and major geographies forecasted till 2026.