Global IC Systems Market
Global IC Systems Market

IC Systems Comprehensive Study by Application (Computer Systems, Communication Systems, Consumer Systems, Automotive Systems, Industrial Systems, Others), Components (Transistors, Diodes, Resistors, Capacitors, Others), Chip Size Type (Small Scale Integration (SSI), Medium Scale Integration (MSI), Large Scale Integration (LSI), Very Large Scale Integration (VLSI)), Fabrication Techniques (Monolithic Integrated Circuits, Film Integrated Circuit, Hybrid or Multi-chip Integrated Circuits)

IC Systems Market Segmented into XX Submarkets. | Forecast Years: 2020- 2025  

Feb 2020 Edition 235 Pages 212 Tables & Figures
  • Summary
  • Market Segments
  • Table of Content
  • List of Tables & Figures
  • Companies Mentioned
Global IC Systems Market Overview:
Integrated circuit systems consist of circuit components such as transistors, diodes, resistors, etc. and their interconnections in a closed system to perform a complete electronic function. These components are connected with a small chip of semiconductor material that is normally silicon. The most common application of Integrated circuit systems in digital watches and scientific calculators. The increasing adoption of IC systems in the automotive industry for the car and driver safety riding leads to the growth of Integrated circuit systems.

Market Drivers
  • The Rising in Automotive Industry leads to the growth for Integrated Circuit Systems
  • Less Energy Consumption of Integrated Circuit Systems than Discrete Circuit

Market Trend
  • Trend to Minimize the IC Systems Size

Restraints
  • High Exposure to Heat May Cause Damage to IC Systems

Opportunities
  • Low Costs of Manufacturing and High Operation Speed
  • Increasing Demand for IC Systems in Consumer Electronics Devices

Challenges
  • System and Component Reliability


Competitive Landscape:

Some of the key players profiled in the report are Intel Corporation (United States), Samsung Electronics Co., Ltd (South Korea), Taiwan Semiconductor Manufacturing Company, Limited (Taiwan), SK Hynix Inc. (South Korea), Micron Technology, Inc. (United States), Broadcom Inc. (United States), Qualcomm Incorporated (United States), Texas Instruments (United States), Toshiba Corporation (Japan), Nvidia Corporation (United States), Panasonic Corporation (Japan), Seiko Epson Corporation (Japan), Spansion Inc. (United States) and United Microelectronics Corporation (Taiwan). Analyst at AdvanceMarketAnalytics see North America and Asia Pacific Players to retain maximum share of Global IC Systems market by 2025. Considering Market by Components, the sub-segment i.e. Transistors will boost the IC Systems market. Considering Market by Chip Size Type, the sub-segment i.e. Small Scale Integration (SSI) will boost the IC Systems market. Considering Market by Fabrication Techniques, the sub-segment i.e. Monolithic Integrated Circuits will boost the IC Systems market.

Market Highlights:
New Entrants/Investors, Raw Material Suppliers, Integrated Circuit System Manufacturers, Dealers, Suppliers, Traders, and Distributors, Government Regulatory and Research Organizations and End Users

In September 2019, Mitsubishi Electric Corporation, a Japan-based manufacturer of electric equipment launched a low-cost high voltage (600V) integrated circuit that helps in electric bikes and industrial equipment. and In February 2019, PragmatIC, a manufacturer of low-cost flexible electronics launched a new series named PR1100 ConnectIC series that is best for use in inventory management, item identification and tracking, supply chain assurance, and brand authentication.

Available Customization:
Data related to EXIM [Export- Import], production & consumption by country or regional level break-up can be provided based on client request**
** Confirmation on availability of data would be provided prior to purchase

Research Methodology:
The top-down and bottom-up approaches are used to estimate and validate the size of the Global IC Systems market.
In order to reach an exhaustive list of functional and relevant players various industry classification standards are closely followed such as NAICS, ICB, SIC to penetrate deep in important geographies by players and a thorough validation test is conducted to reach most relevant players for survey in IC Systems market.
In order to make priority list sorting is done based on revenue generated based on latest reporting with the help of paid databases such as Factiva, Bloomberg etc.
Finally the questionnaire is set and specifically designed to address all the necessities for primary data collection after getting prior appointment.
This helps us to gather the data related to players revenue, operating cycle and expense, profit along with product or service growth etc.
Almost 70-80% of data is collected through primary medium and further validation is done through various secondary sources that includes Regulators, World Bank, Association, Company Website, SEC filings, OTC BB, USPTO, EPO, Annual reports, press releases etc.
Report Objectives / Segmentation Covered
By Application
  • Computer Systems
  • Communication Systems
  • Consumer Systems
  • Automotive Systems
  • Industrial Systems
  • Others
By Components
  • Transistors
  • Diodes
  • Resistors
  • Capacitors
  • Others

By Chip Size Type
  • Small Scale Integration (SSI)
  • Medium Scale Integration (MSI)
  • Large Scale Integration (LSI)
  • Very Large Scale Integration (VLSI)

By Fabrication Techniques
  • Monolithic Integrated Circuits
  • Film Integrated Circuit
  • Hybrid or Multi-chip Integrated Circuits

By Regions
    • 1. Market Overview
      • 1.1. Introduction
      • 1.2. Scope/Objective of the Study
        • 1.2.1. Research Objective
    • 2. Executive Summary
      • 2.1. Introduction
    • 3. Market Dynamics
      • 3.1. Introduction
      • 3.2. Market Drivers
        • 3.2.1. The Rising in Automotive Industry leads to the growth for Integrated Circuit Systems
        • 3.2.2. Less Energy Consumption of Integrated Circuit Systems than Discrete Circuit
      • 3.3. Market Challenges
        • 3.3.1. System and Component Reliability
      • 3.4. Market Trends
        • 3.4.1. Trend to Minimize the IC Systems Size
    • 4. Market Factor Analysis
      • 4.1. Porters Five Forces
      • 4.2. Supply/Value Chain
      • 4.3. PESTEL analysis
      • 4.4. Market Entropy
      • 4.5. Patent/Trademark Analysis
    • 5. Global IC Systems, by Application, Components, Chip Size Type and Fabrication Techniques (value, volume and price ) (2014-2019)
      • 5.1. Introduction
      • 5.2. Global IC Systems (Value)
        • 5.2.1. Global IC Systems by: Application (Value)
          • 5.2.1.1. Computer Systems
          • 5.2.1.2. Communication Systems
          • 5.2.1.3. Consumer Systems
          • 5.2.1.4. Automotive Systems
          • 5.2.1.5. Industrial Systems
          • 5.2.1.6. Others
        • 5.2.2. Global IC Systems by: Components (Value)
          • 5.2.2.1. Transistors
          • 5.2.2.2. Diodes
          • 5.2.2.3. Resistors
          • 5.2.2.4. Capacitors
          • 5.2.2.5. Others
        • 5.2.3. Global IC Systems by: Chip Size Type (Value)
          • 5.2.3.1. Small Scale Integration (SSI)
          • 5.2.3.2. Medium Scale Integration (MSI)
          • 5.2.3.3. Large Scale Integration (LSI)
          • 5.2.3.4. Very Large Scale Integration (VLSI)
        • 5.2.4. Global IC Systems by: Fabrication Techniques (Value)
          • 5.2.4.1. Monolithic Integrated Circuits
          • 5.2.4.2. Film Integrated Circuit
          • 5.2.4.3. Hybrid or Multi-chip Integrated Circuits
      • 5.3. Global IC Systems (Volume)
        • 5.3.1. Global IC Systems by: Application (Volume)
          • 5.3.1.1. Computer Systems
          • 5.3.1.2. Communication Systems
          • 5.3.1.3. Consumer Systems
          • 5.3.1.4. Automotive Systems
          • 5.3.1.5. Industrial Systems
          • 5.3.1.6. Others
        • 5.3.2. Global IC Systems by: Components (Volume)
          • 5.3.2.1. Transistors
          • 5.3.2.2. Diodes
          • 5.3.2.3. Resistors
          • 5.3.2.4. Capacitors
          • 5.3.2.5. Others
        • 5.3.3. Global IC Systems by: Chip Size Type (Volume)
          • 5.3.3.1. Small Scale Integration (SSI)
          • 5.3.3.2. Medium Scale Integration (MSI)
          • 5.3.3.3. Large Scale Integration (LSI)
          • 5.3.3.4. Very Large Scale Integration (VLSI)
        • 5.3.4. Global IC Systems by: Fabrication Techniques (Volume)
          • 5.3.4.1. Monolithic Integrated Circuits
          • 5.3.4.2. Film Integrated Circuit
          • 5.3.4.3. Hybrid or Multi-chip Integrated Circuits
      • 5.4. Global IC Systems (Price)
    • 6. IC Systems: Manufacturers/Players Analysis
      • 6.1. Competitive Landscape
        • 6.1.1. Market Share Analysis
          • 6.1.1.1. Top 3
          • 6.1.1.2. Top 5
      • 6.2. Peer Group Analysis (2019)
      • 6.3. BCG Matrix
      • 6.4. Company Profile
        • 6.4.1. Intel Corporation (United States)
          • 6.4.1.1. Business Overview
          • 6.4.1.2. Products/Services Offerings
          • 6.4.1.3. Financial Analysis
          • 6.4.1.4. SWOT Analysis
        • 6.4.2. Samsung Electronics Co., Ltd (South Korea)
          • 6.4.2.1. Business Overview
          • 6.4.2.2. Products/Services Offerings
          • 6.4.2.3. Financial Analysis
          • 6.4.2.4. SWOT Analysis
        • 6.4.3. Taiwan Semiconductor Manufacturing Company, Limited (Taiwan)
          • 6.4.3.1. Business Overview
          • 6.4.3.2. Products/Services Offerings
          • 6.4.3.3. Financial Analysis
          • 6.4.3.4. SWOT Analysis
        • 6.4.4. SK Hynix Inc. (South Korea)
          • 6.4.4.1. Business Overview
          • 6.4.4.2. Products/Services Offerings
          • 6.4.4.3. Financial Analysis
          • 6.4.4.4. SWOT Analysis
        • 6.4.5. Micron Technology, Inc. (United States)
          • 6.4.5.1. Business Overview
          • 6.4.5.2. Products/Services Offerings
          • 6.4.5.3. Financial Analysis
          • 6.4.5.4. SWOT Analysis
        • 6.4.6. Broadcom Inc. (United States)
          • 6.4.6.1. Business Overview
          • 6.4.6.2. Products/Services Offerings
          • 6.4.6.3. Financial Analysis
          • 6.4.6.4. SWOT Analysis
        • 6.4.7. Qualcomm Incorporated (United States)
          • 6.4.7.1. Business Overview
          • 6.4.7.2. Products/Services Offerings
          • 6.4.7.3. Financial Analysis
          • 6.4.7.4. SWOT Analysis
        • 6.4.8. Texas Instruments (United States)
          • 6.4.8.1. Business Overview
          • 6.4.8.2. Products/Services Offerings
          • 6.4.8.3. Financial Analysis
          • 6.4.8.4. SWOT Analysis
        • 6.4.9. Toshiba Corporation (Japan)
          • 6.4.9.1. Business Overview
          • 6.4.9.2. Products/Services Offerings
          • 6.4.9.3. Financial Analysis
          • 6.4.9.4. SWOT Analysis
        • 6.4.10. Nvidia Corporation (United States)
          • 6.4.10.1. Business Overview
          • 6.4.10.2. Products/Services Offerings
          • 6.4.10.3. Financial Analysis
          • 6.4.10.4. SWOT Analysis
        • 6.4.11. Panasonic Corporation (Japan)
          • 6.4.11.1. Business Overview
          • 6.4.11.2. Products/Services Offerings
          • 6.4.11.3. Financial Analysis
          • 6.4.11.4. SWOT Analysis
        • 6.4.12. Seiko Epson Corporation (Japan)
          • 6.4.12.1. Business Overview
          • 6.4.12.2. Products/Services Offerings
          • 6.4.12.3. Financial Analysis
          • 6.4.12.4. SWOT Analysis
        • 6.4.13. Spansion Inc. (United States)
          • 6.4.13.1. Business Overview
          • 6.4.13.2. Products/Services Offerings
          • 6.4.13.3. Financial Analysis
          • 6.4.13.4. SWOT Analysis
        • 6.4.14. United Microelectronics Corporation (Taiwan)
          • 6.4.14.1. Business Overview
          • 6.4.14.2. Products/Services Offerings
          • 6.4.14.3. Financial Analysis
          • 6.4.14.4. SWOT Analysis
    • 7. Global IC Systems Sale, by Application, Components, Chip Size Type and Fabrication Techniques (value, volume and price ) (2020-2025)
      • 7.1. Introduction
      • 7.2. Global IC Systems (Value)
        • 7.2.1. Global IC Systems by: Application (Value)
          • 7.2.1.1. Computer Systems
          • 7.2.1.2. Communication Systems
          • 7.2.1.3. Consumer Systems
          • 7.2.1.4. Automotive Systems
          • 7.2.1.5. Industrial Systems
          • 7.2.1.6. Others
        • 7.2.2. Global IC Systems by: Components (Value)
          • 7.2.2.1. Transistors
          • 7.2.2.2. Diodes
          • 7.2.2.3. Resistors
          • 7.2.2.4. Capacitors
          • 7.2.2.5. Others
        • 7.2.3. Global IC Systems by: Chip Size Type (Value)
          • 7.2.3.1. Small Scale Integration (SSI)
          • 7.2.3.2. Medium Scale Integration (MSI)
          • 7.2.3.3. Large Scale Integration (LSI)
          • 7.2.3.4. Very Large Scale Integration (VLSI)
        • 7.2.4. Global IC Systems by: Fabrication Techniques (Value)
          • 7.2.4.1. Monolithic Integrated Circuits
          • 7.2.4.2. Film Integrated Circuit
          • 7.2.4.3. Hybrid or Multi-chip Integrated Circuits
      • 7.3. Global IC Systems (Volume)
        • 7.3.1. Global IC Systems by: Application (Volume)
          • 7.3.1.1. Computer Systems
          • 7.3.1.2. Communication Systems
          • 7.3.1.3. Consumer Systems
          • 7.3.1.4. Automotive Systems
          • 7.3.1.5. Industrial Systems
          • 7.3.1.6. Others
        • 7.3.2. Global IC Systems by: Components (Volume)
          • 7.3.2.1. Transistors
          • 7.3.2.2. Diodes
          • 7.3.2.3. Resistors
          • 7.3.2.4. Capacitors
          • 7.3.2.5. Others
        • 7.3.3. Global IC Systems by: Chip Size Type (Volume)
          • 7.3.3.1. Small Scale Integration (SSI)
          • 7.3.3.2. Medium Scale Integration (MSI)
          • 7.3.3.3. Large Scale Integration (LSI)
          • 7.3.3.4. Very Large Scale Integration (VLSI)
        • 7.3.4. Global IC Systems by: Fabrication Techniques (Volume)
          • 7.3.4.1. Monolithic Integrated Circuits
          • 7.3.4.2. Film Integrated Circuit
          • 7.3.4.3. Hybrid or Multi-chip Integrated Circuits
      • 7.4. Global IC Systems (Price)
    • 8. Appendix
      • 8.1. Acronyms
    • 9. Methodology and Data Source
      • 9.1. Methodology/Research Approach
        • 9.1.1. Research Programs/Design
        • 9.1.2. Market Size Estimation
        • 9.1.3. Market Breakdown and Data Triangulation
      • 9.2. Data Source
        • 9.2.1. Secondary Sources
        • 9.2.2. Primary Sources
      • 9.3. Disclaimer
    List of Tables
    • Table 1. IC Systems: by Application(USD Million)
    • Table 2. IC Systems: by Components(USD Million)
    • Table 3. IC Systems: by Chip Size Type(USD Million)
    • Table 4. IC Systems: by Fabrication Techniques(USD Million)
    • Table 5. IC Systems Sales: by Application(Units)
    • Table 6. IC Systems Sales: by Components(Units)
    • Table 7. IC Systems Sales: by Chip Size Type(Units)
    • Table 8. IC Systems Sales: by Fabrication Techniques(Units)
    • Table 9. Company Basic Information, Sales Area and Its Competitors
    • Table 10. Company Basic Information, Sales Area and Its Competitors
    • Table 11. Company Basic Information, Sales Area and Its Competitors
    • Table 12. Company Basic Information, Sales Area and Its Competitors
    • Table 13. Company Basic Information, Sales Area and Its Competitors
    • Table 14. Company Basic Information, Sales Area and Its Competitors
    • Table 15. Company Basic Information, Sales Area and Its Competitors
    • Table 16. Company Basic Information, Sales Area and Its Competitors
    • Table 17. Company Basic Information, Sales Area and Its Competitors
    • Table 18. Company Basic Information, Sales Area and Its Competitors
    • Table 19. Company Basic Information, Sales Area and Its Competitors
    • Table 20. Company Basic Information, Sales Area and Its Competitors
    • Table 21. Company Basic Information, Sales Area and Its Competitors
    • Table 22. Company Basic Information, Sales Area and Its Competitors
    • Table 23. IC Systems: by Application(USD Million)
    • Table 24. IC Systems: by Components(USD Million)
    • Table 25. IC Systems: by Chip Size Type(USD Million)
    • Table 26. IC Systems: by Fabrication Techniques(USD Million)
    • Table 27. IC Systems Sales: by Application(Units)
    • Table 28. IC Systems Sales: by Components(Units)
    • Table 29. IC Systems Sales: by Chip Size Type(Units)
    • Table 30. IC Systems Sales: by Fabrication Techniques(Units)
    • Table 31. Research Programs/Design for This Report
    • Table 32. Key Data Information from Secondary Sources
    • Table 33. Key Data Information from Primary Sources
    List of Figures
    • Figure 1. Porters Five Forces
    • Figure 2. Supply/Value Chain
    • Figure 3. PESTEL analysis
    • Figure 4. Global IC Systems: by Application USD Million (2014-2019)
    • Figure 5. Global IC Systems: by Components USD Million (2014-2019)
    • Figure 6. Global IC Systems: by Chip Size Type USD Million (2014-2019)
    • Figure 7. Global IC Systems: by Fabrication Techniques USD Million (2014-2019)
    • Figure 8. Global IC Systems: by Application Units (2014-2019)
    • Figure 9. Global IC Systems: by Components Units (2014-2019)
    • Figure 10. Global IC Systems: by Chip Size Type Units (2014-2019)
    • Figure 11. Global IC Systems: by Fabrication Techniques Units (2014-2019)
    • Figure 12. Global IC Systems share by Players 2019 (%)
    • Figure 13. Global IC Systems share by Players (Top 3) 2019(%)
    • Figure 14. Global IC Systems share by Players (Top 5) 2019(%)
    • Figure 15. BCG Matrix for key Companies
    • Figure 16. Intel Corporation (United States) Revenue, Net Income and Gross profit
    • Figure 17. Intel Corporation (United States) Revenue: by Geography 2019
    • Figure 18. Samsung Electronics Co., Ltd (South Korea) Revenue, Net Income and Gross profit
    • Figure 19. Samsung Electronics Co., Ltd (South Korea) Revenue: by Geography 2019
    • Figure 20. Taiwan Semiconductor Manufacturing Company, Limited (Taiwan) Revenue, Net Income and Gross profit
    • Figure 21. Taiwan Semiconductor Manufacturing Company, Limited (Taiwan) Revenue: by Geography 2019
    • Figure 22. SK Hynix Inc. (South Korea) Revenue, Net Income and Gross profit
    • Figure 23. SK Hynix Inc. (South Korea) Revenue: by Geography 2019
    • Figure 24. Micron Technology, Inc. (United States) Revenue, Net Income and Gross profit
    • Figure 25. Micron Technology, Inc. (United States) Revenue: by Geography 2019
    • Figure 26. Broadcom Inc. (United States) Revenue, Net Income and Gross profit
    • Figure 27. Broadcom Inc. (United States) Revenue: by Geography 2019
    • Figure 28. Qualcomm Incorporated (United States) Revenue, Net Income and Gross profit
    • Figure 29. Qualcomm Incorporated (United States) Revenue: by Geography 2019
    • Figure 30. Texas Instruments (United States) Revenue, Net Income and Gross profit
    • Figure 31. Texas Instruments (United States) Revenue: by Geography 2019
    • Figure 32. Toshiba Corporation (Japan) Revenue, Net Income and Gross profit
    • Figure 33. Toshiba Corporation (Japan) Revenue: by Geography 2019
    • Figure 34. Nvidia Corporation (United States) Revenue, Net Income and Gross profit
    • Figure 35. Nvidia Corporation (United States) Revenue: by Geography 2019
    • Figure 36. Panasonic Corporation (Japan) Revenue, Net Income and Gross profit
    • Figure 37. Panasonic Corporation (Japan) Revenue: by Geography 2019
    • Figure 38. Seiko Epson Corporation (Japan) Revenue, Net Income and Gross profit
    • Figure 39. Seiko Epson Corporation (Japan) Revenue: by Geography 2019
    • Figure 40. Spansion Inc. (United States) Revenue, Net Income and Gross profit
    • Figure 41. Spansion Inc. (United States) Revenue: by Geography 2019
    • Figure 42. United Microelectronics Corporation (Taiwan) Revenue, Net Income and Gross profit
    • Figure 43. United Microelectronics Corporation (Taiwan) Revenue: by Geography 2019
    • Figure 44. Global IC Systems: by Application USD Million (2020-2025)
    • Figure 45. Global IC Systems: by Components USD Million (2020-2025)
    • Figure 46. Global IC Systems: by Chip Size Type USD Million (2020-2025)
    • Figure 47. Global IC Systems: by Fabrication Techniques USD Million (2020-2025)
    • Figure 48. Global IC Systems: by Application Units (2020-2025)
    • Figure 49. Global IC Systems: by Components Units (2020-2025)
    • Figure 50. Global IC Systems: by Chip Size Type Units (2020-2025)
    • Figure 51. Global IC Systems: by Fabrication Techniques Units (2020-2025)
    Some of the key companies/manufacturers profiled in the report
    • Intel Corporation (United States)
    • Samsung Electronics Co., Ltd (South Korea)
    • Taiwan Semiconductor Manufacturing Company, Limited (Taiwan)
    • SK Hynix Inc. (South Korea)
    • Micron Technology, Inc. (United States)
    • Broadcom Inc. (United States)
    • Qualcomm Incorporated (United States)
    • Texas Instruments (United States)
    • Toshiba Corporation (Japan)
    • Nvidia Corporation (United States)
    • Panasonic Corporation (Japan)
    • Seiko Epson Corporation (Japan)
    • Spansion Inc. (United States)
    • United Microelectronics Corporation (Taiwan)
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