Cooling Paste also known as the thermal paste is a chemical compound that is thermally conductive and used to dissipate heat and plug air gaps between a heatsink and a heat source. These paste have the function of filling the microscopic imperfections of the surfaces in contact, which inevitably retain the air particles. The rising use of the cooling paste to improve thermal contact between electronic components has driven the market growth. This paste helps to keep the processor cool. In addition, these paste highly in demand from end-use industries such as telecommunications and electronics.
- Rapid Digitalization Led to Increase in Demand for Electronic Devices
- Cost-Effectiveness And High-Performance Feature Of Cooling Paste
- Urbanization And Continuous Technological Advancement
- Availability of Counterfeit Low-Quality Products
The key Vendors profiled in the report are Parker-Hannifin Corporation (United States), Henkel AG & Co. KGaA (Germany), Momentive (United States), Laird Technologies, Inc. (United States), Wakefield-Vette, Inc. (United States), 3M Company (United States), Shin-Etsu Chemical Co., Ltd. (Japan), Kobayashi Pharmaceutical Co (Japan), I.M Technology Co. (Taiwan), MG Chemicals (Canada) and Cooler Master Technology Inc. (Taiwan).