Global Outsourced Semiconductor Assembly and Test Market
Global Outsourced Semiconductor Assembly and Test Market

Outsourced Semiconductor Assembly and Test Comprehensive Study by Application (Mining, Metal & Minerals, Vehicle & Road Traffic, Hardware, Others), Services (Testing Services {Wafer Test and Final Test}, Assembly Service {QFN, BGA, WLCSP}), Packaged (Chip Scale Package, Multi Package, Ball Grid Array, Others) Players and Region - Global Market Outlook to 2026

Outsourced Semiconductor Assembly and Test Market Segmented into XX Submarkets. | Forecast Years: 2021- 2026  

Nov 2021 Edition 217 Pages 218 Tables & Figures
  • Summary
  • Market Segments
  • Table of Content
  • List of Tables & Figures
  • Companies Mentioned
Global Outsourced Semiconductor Assembly and Test Market Overview:
Outsourced semiconductor assembly and test (OSAT) involves the assembly of semiconductors in various applications especially in electronics products and testing of the semiconductor range. The services include the process of assembling the semiconductor or integrated circuit in one form or another. It consists of a range of packaging methods that include wire bonding, die-attach, encapsulation, deflash, lead trimming, lead finish, and others. The outsourced semiconductor assembly and test services include tests wafer test and final test, and QFN, BGA, WLCSP assembly services.

Growth Drivers
  • Growing Demand for the Electronics Products like TVs, Smartphones, Automotive Electronics, etc
  • Demand for the Testing Services in Semiconductor to Avoid any Mishappening During the Operations

Roadblocks
  • Price Fluctuations in the Outsourced Semiconductor Assembly and Test Due to the Changing Demand from the Clients

Opportunities
  • Surging Semiconductor Market with the Emergence of 5G Technologies and Smart City Projects will Boost the Outsourced Semiconductor Assembly and Test Market

Challenges
  • Regulatory Guidelines and Standards Involved in Outsourced Semiconductor Assembly and Test Market


Competitive Landscape:

Some of the key players profiled in the report are Amkor Technology Inc. (United States), ChipMOS TECHNOLOGIES (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), ASE Group (Taiwan), Hana Micron (South Korea), Powertech Technology Inc. (Taiwan), UTAC (Taiwan), Walton Advanced Engineering, Inc (Taiwan), TongFu Microelectronics Co., Ltd. (China) and King Yuan Electronics Co (Taiwan). Considering Market by Services, the sub-segment i.e. Testing Services {Wafer Test and Final Test} will boost the Outsourced Semiconductor Assembly and Test market. Considering Market by Packaged, the sub-segment i.e. Chip Scale Package will boost the Outsourced Semiconductor Assembly and Test market.

Latest Market Insights:
On 28th January 2021, Sigurd Microelectronics, an outsourced semiconductor assembly, and testing (OSAT) firm, recently announced it would acquire UTAC Taiwan for USD165 million. The purchasing company anticipates its footprint expanding transaction will be completed in the second quarter of this year. The deal will enable the merged corporation to significantly increase its production capacity and annual revenue. Sigurd plans to use UTAC Taiwan’s resources to increase its automotive and 5G component-related revenue.

"The ISO 15408-EAL6 certificate is an international standard for IT product security certification. The certification received by ASE was issued by the German Government’s Federal Office for IT Security (Bundesamt für Sicherheit in der Informationstechnik, BSI) which is the central IT security service provider for the German federal government. BSI also offers its services to private and commercial users of information technology."

What Can be Explored with the Outsourced Semiconductor Assembly and Test Market Study
 Gain Market Understanding
 Identify Growth Opportunities
 Analyze and Measure the Global Outsourced Semiconductor Assembly and Test Market by Identifying Investment across various Industry Verticals
 Understand the Trends that will drive Future Changes in Outsourced Semiconductor Assembly and Test
 Understand the Competitive Scenario
- Track Right Markets
- Identify the Right Verticals

Research Methodology:
The top-down and bottom-up approaches are used to estimate and validate the size of the Global Outsourced Semiconductor Assembly and Test market.
In order to reach an exhaustive list of functional and relevant players various industry classification standards are closely followed such as NAICS, ICB, SIC to penetrate deep in important geographies by players and a thorough validation test is conducted to reach most relevant players for survey in Outsourced Semiconductor Assembly and Test market.
In order to make priority list sorting is done based on revenue generated based on latest reporting with the help of paid databases such as Factiva, Bloomberg etc.
Finally the questionnaire is set and specifically designed to address all the necessities for primary data collection after getting prior appointment by targeting key target audience that includes Outsourced Semiconductor Assembly and Test Providers, Outsourced Semiconductor Assembly and Test Industry Association, Research and Development Institutes, Potential Investors, Regulatory Bodies and Others.
This helps us to gather the data related to players revenue, operating cycle and expense, profit along with product or service growth etc.
Almost 70-80% of data is collected through primary medium and further validation is done through various secondary sources that includes Regulators, World Bank, Association, Company Website, SEC filings, OTC BB, USPTO, EPO, Annual reports, press releases etc.

Frequently Asked Questions (FAQ):

1. What is the growth rate predicted for the Global Outsourced Semiconductor Assembly and Test Market?
The Outsourced Semiconductor Assembly and Test market is expected to see a CAGR of % during projected year 2020 to 2026.

2. Who are the top performing companies in Outsourced Semiconductor Assembly and Test Market?
Top performing companies in the Global Outsourced Semiconductor Assembly and Test market are Amkor Technology Inc. (United States), ChipMOS TECHNOLOGIES (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), ASE Group (Taiwan), Hana Micron (South Korea), Powertech Technology Inc. (Taiwan), UTAC (Taiwan), Walton Advanced Engineering, Inc (Taiwan), TongFu Microelectronics Co., Ltd. (China) and King Yuan Electronics Co (Taiwan), to name a few.

3. What trending factors would impact Outsourced Semiconductor Assembly and Test Market growth most?
"Adoption of Artificial Intelligence and Other Associated Technologies in Outsourced Semiconductor Assembly and Test" is seen as one of major influencing trends for Outsourced Semiconductor Assembly and Test Market during projected period 2020-2026.

Report Objectives / Segmentation Covered
By Application
  • Mining, Metal & Minerals
  • Vehicle & Road Traffic
  • Hardware
  • Others
By Services
  • Testing Services {Wafer Test and Final Test}
  • Assembly Service {QFN, BGA, WLCSP}

By Packaged
  • Chip Scale Package
  • Multi Package
  • Ball Grid Array
  • Others

By Regions
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Taiwan
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • Italy
    • United Kingdom
    • Netherlands
    • Rest of Europe
  • MEA
    • Middle East
    • Africa
  • North America
    • United States
    • Canada
    • Mexico
  • 1. Market Overview
    • 1.1. Introduction
    • 1.2. Scope/Objective of the Study
      • 1.2.1. Research Objective
  • 2. Executive Summary
    • 2.1. Introduction
  • 3. Market Dynamics
    • 3.1. Introduction
    • 3.2. Market Drivers
      • 3.2.1. Growing Demand for the Electronics Products like TVs, Smartphones, Automotive Electronics, etc
      • 3.2.2. Demand for the Testing Services in Semiconductor to Avoid any Mishappening During the Operations
    • 3.3. Market Challenges
      • 3.3.1. Regulatory Guidelines and Standards Involved in Outsourced Semiconductor Assembly and Test Market
    • 3.4. Market Trends
      • 3.4.1. Adoption of Artificial Intelligence and Other Associated Technologies in Outsourced Semiconductor Assembly and Test
  • 4. Market Factor Analysis
    • 4.1. Porters Five Forces
    • 4.2. Supply/Value Chain
    • 4.3. PESTEL analysis
    • 4.4. Market Entropy
    • 4.5. Patent/Trademark Analysis
  • 5. Global Outsourced Semiconductor Assembly and Test, by Application, Services, Packaged and Region (value and price ) (2015-2020)
    • 5.1. Introduction
    • 5.2. Global Outsourced Semiconductor Assembly and Test (Value)
      • 5.2.1. Global Outsourced Semiconductor Assembly and Test by: Application (Value)
        • 5.2.1.1. Mining, Metal & Minerals
        • 5.2.1.2. Vehicle & Road Traffic
        • 5.2.1.3. Hardware
        • 5.2.1.4. Others
      • 5.2.2. Global Outsourced Semiconductor Assembly and Test by: Services (Value)
        • 5.2.2.1. Testing Services {Wafer Test and Final Test}
        • 5.2.2.2. Assembly Service {QFN, BGA, WLCSP}
      • 5.2.3. Global Outsourced Semiconductor Assembly and Test by: Packaged (Value)
        • 5.2.3.1. Chip Scale Package
        • 5.2.3.2. Multi Package
        • 5.2.3.3. Ball Grid Array
        • 5.2.3.4. Others
      • 5.2.4. Global Outsourced Semiconductor Assembly and Test Region
        • 5.2.4.1. South America
          • 5.2.4.1.1. Brazil
          • 5.2.4.1.2. Argentina
          • 5.2.4.1.3. Rest of South America
        • 5.2.4.2. Asia Pacific
          • 5.2.4.2.1. China
          • 5.2.4.2.2. Japan
          • 5.2.4.2.3. India
          • 5.2.4.2.4. South Korea
          • 5.2.4.2.5. Taiwan
          • 5.2.4.2.6. Australia
          • 5.2.4.2.7. Rest of Asia-Pacific
        • 5.2.4.3. Europe
          • 5.2.4.3.1. Germany
          • 5.2.4.3.2. France
          • 5.2.4.3.3. Italy
          • 5.2.4.3.4. United Kingdom
          • 5.2.4.3.5. Netherlands
          • 5.2.4.3.6. Rest of Europe
        • 5.2.4.4. MEA
          • 5.2.4.4.1. Middle East
          • 5.2.4.4.2. Africa
        • 5.2.4.5. North America
          • 5.2.4.5.1. United States
          • 5.2.4.5.2. Canada
          • 5.2.4.5.3. Mexico
    • 5.3. Global Outsourced Semiconductor Assembly and Test (Price)
  • 6. Outsourced Semiconductor Assembly and Test: Manufacturers/Players Analysis
    • 6.1. Competitive Landscape
      • 6.1.1. Market Share Analysis
        • 6.1.1.1. Top 3
        • 6.1.1.2. Top 5
    • 6.2. Peer Group Analysis (2020)
    • 6.3. BCG Matrix
    • 6.4. Company Profile
      • 6.4.1. Amkor Technology Inc. (United States)
        • 6.4.1.1. Business Overview
        • 6.4.1.2. Products/Services Offerings
        • 6.4.1.3. Financial Analysis
        • 6.4.1.4. SWOT Analysis
      • 6.4.2. ChipMOS TECHNOLOGIES (Taiwan)
        • 6.4.2.1. Business Overview
        • 6.4.2.2. Products/Services Offerings
        • 6.4.2.3. Financial Analysis
        • 6.4.2.4. SWOT Analysis
      • 6.4.3. Siliconware Precision Industries Co., Ltd. (Taiwan)
        • 6.4.3.1. Business Overview
        • 6.4.3.2. Products/Services Offerings
        • 6.4.3.3. Financial Analysis
        • 6.4.3.4. SWOT Analysis
      • 6.4.4. ASE Group (Taiwan)
        • 6.4.4.1. Business Overview
        • 6.4.4.2. Products/Services Offerings
        • 6.4.4.3. Financial Analysis
        • 6.4.4.4. SWOT Analysis
      • 6.4.5. Hana Micron (South Korea)
        • 6.4.5.1. Business Overview
        • 6.4.5.2. Products/Services Offerings
        • 6.4.5.3. Financial Analysis
        • 6.4.5.4. SWOT Analysis
      • 6.4.6. Powertech Technology Inc. (Taiwan)
        • 6.4.6.1. Business Overview
        • 6.4.6.2. Products/Services Offerings
        • 6.4.6.3. Financial Analysis
        • 6.4.6.4. SWOT Analysis
      • 6.4.7. UTAC (Taiwan)
        • 6.4.7.1. Business Overview
        • 6.4.7.2. Products/Services Offerings
        • 6.4.7.3. Financial Analysis
        • 6.4.7.4. SWOT Analysis
      • 6.4.8. Walton Advanced Engineering, Inc (Taiwan)
        • 6.4.8.1. Business Overview
        • 6.4.8.2. Products/Services Offerings
        • 6.4.8.3. Financial Analysis
        • 6.4.8.4. SWOT Analysis
      • 6.4.9. TongFu Microelectronics Co., Ltd. (China)
        • 6.4.9.1. Business Overview
        • 6.4.9.2. Products/Services Offerings
        • 6.4.9.3. Financial Analysis
        • 6.4.9.4. SWOT Analysis
      • 6.4.10. King Yuan Electronics Co (Taiwan)
        • 6.4.10.1. Business Overview
        • 6.4.10.2. Products/Services Offerings
        • 6.4.10.3. Financial Analysis
        • 6.4.10.4. SWOT Analysis
  • 7. Global Outsourced Semiconductor Assembly and Test Sale, by Application, Services, Packaged and Region (value and price ) (2021-2026)
    • 7.1. Introduction
    • 7.2. Global Outsourced Semiconductor Assembly and Test (Value)
      • 7.2.1. Global Outsourced Semiconductor Assembly and Test by: Application (Value)
        • 7.2.1.1. Mining, Metal & Minerals
        • 7.2.1.2. Vehicle & Road Traffic
        • 7.2.1.3. Hardware
        • 7.2.1.4. Others
      • 7.2.2. Global Outsourced Semiconductor Assembly and Test by: Services (Value)
        • 7.2.2.1. Testing Services {Wafer Test and Final Test}
        • 7.2.2.2. Assembly Service {QFN, BGA, WLCSP}
      • 7.2.3. Global Outsourced Semiconductor Assembly and Test by: Packaged (Value)
        • 7.2.3.1. Chip Scale Package
        • 7.2.3.2. Multi Package
        • 7.2.3.3. Ball Grid Array
        • 7.2.3.4. Others
      • 7.2.4. Global Outsourced Semiconductor Assembly and Test Region
        • 7.2.4.1. South America
          • 7.2.4.1.1. Brazil
          • 7.2.4.1.2. Argentina
          • 7.2.4.1.3. Rest of South America
        • 7.2.4.2. Asia Pacific
          • 7.2.4.2.1. China
          • 7.2.4.2.2. Japan
          • 7.2.4.2.3. India
          • 7.2.4.2.4. South Korea
          • 7.2.4.2.5. Taiwan
          • 7.2.4.2.6. Australia
          • 7.2.4.2.7. Rest of Asia-Pacific
        • 7.2.4.3. Europe
          • 7.2.4.3.1. Germany
          • 7.2.4.3.2. France
          • 7.2.4.3.3. Italy
          • 7.2.4.3.4. United Kingdom
          • 7.2.4.3.5. Netherlands
          • 7.2.4.3.6. Rest of Europe
        • 7.2.4.4. MEA
          • 7.2.4.4.1. Middle East
          • 7.2.4.4.2. Africa
        • 7.2.4.5. North America
          • 7.2.4.5.1. United States
          • 7.2.4.5.2. Canada
          • 7.2.4.5.3. Mexico
    • 7.3. Global Outsourced Semiconductor Assembly and Test (Price)
  • 8. Appendix
    • 8.1. Acronyms
  • 9. Methodology and Data Source
    • 9.1. Methodology/Research Approach
      • 9.1.1. Research Programs/Design
      • 9.1.2. Market Size Estimation
      • 9.1.3. Market Breakdown and Data Triangulation
    • 9.2. Data Source
      • 9.2.1. Secondary Sources
      • 9.2.2. Primary Sources
    • 9.3. Disclaimer
List of Tables
  • Table 1. Outsourced Semiconductor Assembly and Test: by Application(USD Million)
  • Table 2. Outsourced Semiconductor Assembly and Test Mining, Metal & Minerals , by Region USD Million (2015-2020)
  • Table 3. Outsourced Semiconductor Assembly and Test Vehicle & Road Traffic , by Region USD Million (2015-2020)
  • Table 4. Outsourced Semiconductor Assembly and Test Hardware , by Region USD Million (2015-2020)
  • Table 5. Outsourced Semiconductor Assembly and Test Others , by Region USD Million (2015-2020)
  • Table 6. Outsourced Semiconductor Assembly and Test: by Services(USD Million)
  • Table 7. Outsourced Semiconductor Assembly and Test Testing Services {Wafer Test and Final Test} , by Region USD Million (2015-2020)
  • Table 8. Outsourced Semiconductor Assembly and Test Assembly Service {QFN, BGA, WLCSP} , by Region USD Million (2015-2020)
  • Table 9. Outsourced Semiconductor Assembly and Test: by Packaged(USD Million)
  • Table 10. Outsourced Semiconductor Assembly and Test Chip Scale Package , by Region USD Million (2015-2020)
  • Table 11. Outsourced Semiconductor Assembly and Test Multi Package , by Region USD Million (2015-2020)
  • Table 12. Outsourced Semiconductor Assembly and Test Ball Grid Array , by Region USD Million (2015-2020)
  • Table 13. Outsourced Semiconductor Assembly and Test Others , by Region USD Million (2015-2020)
  • Table 14. South America Outsourced Semiconductor Assembly and Test, by Country USD Million (2015-2020)
  • Table 15. South America Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 16. South America Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 17. South America Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 18. Brazil Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 19. Brazil Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 20. Brazil Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 21. Argentina Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 22. Argentina Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 23. Argentina Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 24. Rest of South America Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 25. Rest of South America Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 26. Rest of South America Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 27. Asia Pacific Outsourced Semiconductor Assembly and Test, by Country USD Million (2015-2020)
  • Table 28. Asia Pacific Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 29. Asia Pacific Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 30. Asia Pacific Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 31. China Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 32. China Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 33. China Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 34. Japan Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 35. Japan Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 36. Japan Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 37. India Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 38. India Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 39. India Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 40. South Korea Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 41. South Korea Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 42. South Korea Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 43. Taiwan Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 44. Taiwan Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 45. Taiwan Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 46. Australia Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 47. Australia Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 48. Australia Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 49. Rest of Asia-Pacific Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 50. Rest of Asia-Pacific Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 51. Rest of Asia-Pacific Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 52. Europe Outsourced Semiconductor Assembly and Test, by Country USD Million (2015-2020)
  • Table 53. Europe Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 54. Europe Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 55. Europe Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 56. Germany Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 57. Germany Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 58. Germany Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 59. France Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 60. France Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 61. France Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 62. Italy Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 63. Italy Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 64. Italy Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 65. United Kingdom Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 66. United Kingdom Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 67. United Kingdom Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 68. Netherlands Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 69. Netherlands Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 70. Netherlands Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 71. Rest of Europe Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 72. Rest of Europe Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 73. Rest of Europe Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 74. MEA Outsourced Semiconductor Assembly and Test, by Country USD Million (2015-2020)
  • Table 75. MEA Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 76. MEA Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 77. MEA Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 78. Middle East Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 79. Middle East Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 80. Middle East Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 81. Africa Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 82. Africa Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 83. Africa Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 84. North America Outsourced Semiconductor Assembly and Test, by Country USD Million (2015-2020)
  • Table 85. North America Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 86. North America Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 87. North America Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 88. United States Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 89. United States Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 90. United States Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 91. Canada Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 92. Canada Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 93. Canada Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 94. Mexico Outsourced Semiconductor Assembly and Test, by Application USD Million (2015-2020)
  • Table 95. Mexico Outsourced Semiconductor Assembly and Test, by Services USD Million (2015-2020)
  • Table 96. Mexico Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2015-2020)
  • Table 97. Company Basic Information, Sales Area and Its Competitors
  • Table 98. Company Basic Information, Sales Area and Its Competitors
  • Table 99. Company Basic Information, Sales Area and Its Competitors
  • Table 100. Company Basic Information, Sales Area and Its Competitors
  • Table 101. Company Basic Information, Sales Area and Its Competitors
  • Table 102. Company Basic Information, Sales Area and Its Competitors
  • Table 103. Company Basic Information, Sales Area and Its Competitors
  • Table 104. Company Basic Information, Sales Area and Its Competitors
  • Table 105. Company Basic Information, Sales Area and Its Competitors
  • Table 106. Company Basic Information, Sales Area and Its Competitors
  • Table 107. Outsourced Semiconductor Assembly and Test: by Application(USD Million)
  • Table 108. Outsourced Semiconductor Assembly and Test Mining, Metal & Minerals , by Region USD Million (2021-2026)
  • Table 109. Outsourced Semiconductor Assembly and Test Vehicle & Road Traffic , by Region USD Million (2021-2026)
  • Table 110. Outsourced Semiconductor Assembly and Test Hardware , by Region USD Million (2021-2026)
  • Table 111. Outsourced Semiconductor Assembly and Test Others , by Region USD Million (2021-2026)
  • Table 112. Outsourced Semiconductor Assembly and Test: by Services(USD Million)
  • Table 113. Outsourced Semiconductor Assembly and Test Testing Services {Wafer Test and Final Test} , by Region USD Million (2021-2026)
  • Table 114. Outsourced Semiconductor Assembly and Test Assembly Service {QFN, BGA, WLCSP} , by Region USD Million (2021-2026)
  • Table 115. Outsourced Semiconductor Assembly and Test: by Packaged(USD Million)
  • Table 116. Outsourced Semiconductor Assembly and Test Chip Scale Package , by Region USD Million (2021-2026)
  • Table 117. Outsourced Semiconductor Assembly and Test Multi Package , by Region USD Million (2021-2026)
  • Table 118. Outsourced Semiconductor Assembly and Test Ball Grid Array , by Region USD Million (2021-2026)
  • Table 119. Outsourced Semiconductor Assembly and Test Others , by Region USD Million (2021-2026)
  • Table 120. South America Outsourced Semiconductor Assembly and Test, by Country USD Million (2021-2026)
  • Table 121. South America Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 122. South America Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 123. South America Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 124. Brazil Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 125. Brazil Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 126. Brazil Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 127. Argentina Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 128. Argentina Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 129. Argentina Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 130. Rest of South America Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 131. Rest of South America Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 132. Rest of South America Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 133. Asia Pacific Outsourced Semiconductor Assembly and Test, by Country USD Million (2021-2026)
  • Table 134. Asia Pacific Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 135. Asia Pacific Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 136. Asia Pacific Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 137. China Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 138. China Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 139. China Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 140. Japan Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 141. Japan Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 142. Japan Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 143. India Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 144. India Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 145. India Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 146. South Korea Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 147. South Korea Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 148. South Korea Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 149. Taiwan Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 150. Taiwan Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 151. Taiwan Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 152. Australia Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 153. Australia Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 154. Australia Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 155. Rest of Asia-Pacific Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 156. Rest of Asia-Pacific Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 157. Rest of Asia-Pacific Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 158. Europe Outsourced Semiconductor Assembly and Test, by Country USD Million (2021-2026)
  • Table 159. Europe Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 160. Europe Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 161. Europe Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 162. Germany Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 163. Germany Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 164. Germany Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 165. France Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 166. France Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 167. France Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 168. Italy Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 169. Italy Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 170. Italy Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 171. United Kingdom Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 172. United Kingdom Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 173. United Kingdom Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 174. Netherlands Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 175. Netherlands Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 176. Netherlands Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 177. Rest of Europe Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 178. Rest of Europe Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 179. Rest of Europe Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 180. MEA Outsourced Semiconductor Assembly and Test, by Country USD Million (2021-2026)
  • Table 181. MEA Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 182. MEA Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 183. MEA Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 184. Middle East Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 185. Middle East Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 186. Middle East Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 187. Africa Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 188. Africa Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 189. Africa Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 190. North America Outsourced Semiconductor Assembly and Test, by Country USD Million (2021-2026)
  • Table 191. North America Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 192. North America Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 193. North America Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 194. United States Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 195. United States Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 196. United States Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 197. Canada Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 198. Canada Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 199. Canada Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 200. Mexico Outsourced Semiconductor Assembly and Test, by Application USD Million (2021-2026)
  • Table 201. Mexico Outsourced Semiconductor Assembly and Test, by Services USD Million (2021-2026)
  • Table 202. Mexico Outsourced Semiconductor Assembly and Test, by Packaged USD Million (2021-2026)
  • Table 203. Research Programs/Design for This Report
  • Table 204. Key Data Information from Secondary Sources
  • Table 205. Key Data Information from Primary Sources
List of Figures
  • Figure 1. Porters Five Forces
  • Figure 2. Supply/Value Chain
  • Figure 3. PESTEL analysis
  • Figure 4. Global Outsourced Semiconductor Assembly and Test: by Application USD Million (2015-2020)
  • Figure 5. Global Outsourced Semiconductor Assembly and Test: by Services USD Million (2015-2020)
  • Figure 6. Global Outsourced Semiconductor Assembly and Test: by Packaged USD Million (2015-2020)
  • Figure 7. South America Outsourced Semiconductor Assembly and Test Share (%), by Country
  • Figure 8. Asia Pacific Outsourced Semiconductor Assembly and Test Share (%), by Country
  • Figure 9. Europe Outsourced Semiconductor Assembly and Test Share (%), by Country
  • Figure 10. MEA Outsourced Semiconductor Assembly and Test Share (%), by Country
  • Figure 11. North America Outsourced Semiconductor Assembly and Test Share (%), by Country
  • Figure 12. Global Outsourced Semiconductor Assembly and Test share by Players 2020 (%)
  • Figure 13. Global Outsourced Semiconductor Assembly and Test share by Players (Top 3) 2020(%)
  • Figure 14. Global Outsourced Semiconductor Assembly and Test share by Players (Top 5) 2020(%)
  • Figure 15. BCG Matrix for key Companies
  • Figure 16. Amkor Technology Inc. (United States) Revenue, Net Income and Gross profit
  • Figure 17. Amkor Technology Inc. (United States) Revenue: by Geography 2020
  • Figure 18. ChipMOS TECHNOLOGIES (Taiwan) Revenue, Net Income and Gross profit
  • Figure 19. ChipMOS TECHNOLOGIES (Taiwan) Revenue: by Geography 2020
  • Figure 20. Siliconware Precision Industries Co., Ltd. (Taiwan) Revenue, Net Income and Gross profit
  • Figure 21. Siliconware Precision Industries Co., Ltd. (Taiwan) Revenue: by Geography 2020
  • Figure 22. ASE Group (Taiwan) Revenue, Net Income and Gross profit
  • Figure 23. ASE Group (Taiwan) Revenue: by Geography 2020
  • Figure 24. Hana Micron (South Korea) Revenue, Net Income and Gross profit
  • Figure 25. Hana Micron (South Korea) Revenue: by Geography 2020
  • Figure 26. Powertech Technology Inc. (Taiwan) Revenue, Net Income and Gross profit
  • Figure 27. Powertech Technology Inc. (Taiwan) Revenue: by Geography 2020
  • Figure 28. UTAC (Taiwan) Revenue, Net Income and Gross profit
  • Figure 29. UTAC (Taiwan) Revenue: by Geography 2020
  • Figure 30. Walton Advanced Engineering, Inc (Taiwan) Revenue, Net Income and Gross profit
  • Figure 31. Walton Advanced Engineering, Inc (Taiwan) Revenue: by Geography 2020
  • Figure 32. TongFu Microelectronics Co., Ltd. (China) Revenue, Net Income and Gross profit
  • Figure 33. TongFu Microelectronics Co., Ltd. (China) Revenue: by Geography 2020
  • Figure 34. King Yuan Electronics Co (Taiwan) Revenue, Net Income and Gross profit
  • Figure 35. King Yuan Electronics Co (Taiwan) Revenue: by Geography 2020
  • Figure 36. Global Outsourced Semiconductor Assembly and Test: by Application USD Million (2021-2026)
  • Figure 37. Global Outsourced Semiconductor Assembly and Test: by Services USD Million (2021-2026)
  • Figure 38. Global Outsourced Semiconductor Assembly and Test: by Packaged USD Million (2021-2026)
  • Figure 39. South America Outsourced Semiconductor Assembly and Test Share (%), by Country
  • Figure 40. Asia Pacific Outsourced Semiconductor Assembly and Test Share (%), by Country
  • Figure 41. Europe Outsourced Semiconductor Assembly and Test Share (%), by Country
  • Figure 42. MEA Outsourced Semiconductor Assembly and Test Share (%), by Country
  • Figure 43. North America Outsourced Semiconductor Assembly and Test Share (%), by Country
Some of the key companies/manufacturers profiled in the report
  • Amkor Technology Inc. (United States)
  • ChipMOS TECHNOLOGIES (Taiwan)
  • Siliconware Precision Industries Co., Ltd. (Taiwan)
  • ASE Group (Taiwan)
  • Hana Micron (South Korea)
  • Powertech Technology Inc. (Taiwan)
  • UTAC (Taiwan)
  • Walton Advanced Engineering, Inc (Taiwan)
  • TongFu Microelectronics Co., Ltd. (China)
  • King Yuan Electronics Co (Taiwan)
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