Global Interposer Market Overview:
An interposer is an electrical interface whose main objective is to reroute one connection to a different connection. It helps in higher-level integration and enables a greater number of external contacts by the electrical devices. It also facilitates increased speed, improved electrical and thermal performance, and more interconnections. Interposers provide a much larger channel for electrical signals, thereby reducing the amount of energy needed to drive those signals. It also minimizes the resistance/capacitance (RC) delay and shortens the distance between various IP blocks in a system and the memories associated with them. Some of the players profiled in the study are United Microelectronics Corporation (Taiwan), ASE Technology Holding Co., Ltd. (Taiwan), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Intel Corporation (United States), Amkor Technology (United States), Toshiba Corporation (Japan), Broadcom Inc. (United States), Samsung Electronics Co., Ltd. (South Korea) and Texas Instruments Incorporated (United States).
On the basis of geography, the market of Interposer has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). If we see Market by Raw Material, the sub-segment i.e. Silicon will boost the Interposer market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Industry Vertical, the sub-segment i.e. Electrical & Electronics will boost the Interposer market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Sales Channel, the sub-segment i.e. Online will boost the Interposer market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Packaging Technology, the sub-segment i.e. 2D Interposer will boost the Interposer market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth.
Market Growth Drivers
- Growing Demand from End-Use Industries Such As Consumer Electronics and Military & Defense Sector Due To the Need for Higher I/O Density and Specific Performance Requirements
- Increasing Demand for High-performance Computing Systems
- The Surge in the Demand of Advanced Wafer Level Packaging Technologies in Sensors and MEMEs
- The Rise in the Use of Connected and Wearable Devices
- The Growing Trend of Miniaturization of Electronic Devices Such As Mobile Phones, Tablets, and Gaming Devices
- Growing Demand of Through-silicon Vias (TSV) for Transmission of Signals
- High Cost than Conventional Packaging which Limits 2.5D to High-end Applications
- Growing Technological Developments such as the Internet of Things (IoT) and Connected and Self-Driving Cars Owing To the Requirement of Higher Bandwidth Data Processing and Communications
- Increasing Research Activities in the Field of Material Technology Such As Glass Interposers, And Advancements in Packaging to Lower Cost
- Performance, and Cost Barriers Induced By the Interposer Materials
- Performance Limitations of Silicon Interposer
- Manufacturing Challenges Such As Surface Defects That Leads To Cracking
Key Market Developments:
On October 18, 2016, Murata Manufacturing Co., Ltd. has completed the acquisition of IPDiA S.A., a 3D silicon capacitor technology. IPDiA is a leading manufacturer of Integrated Passive Devices.
On November 30, 2020, Broadcom Inc. has announced sampling of its 5nm ASIC device for data center and cloud infrastructure. Built on TSMC’s N5 process and measuring 625 mm2, this device incorporates PCIe Gen5 protocol, 112-Gbps SerDes, HBM2e memory operating at 3.6 Gbps, and 3.6-Tbps Die2Die PHY IP utilizing TSMC CoWoS® interposer technology.
Interposer Manufacturers, Consumer Electronics Manufacturers, Raw Material Suppliers, Automobile and Defense Organization, End-Use Industries and Others
Major Objectives Focused through this Study
To define, describe, and forecast the Global Interposer market on the basis of product  , application [Communication Systems, Network and Signal Processing, RF and Opto-electronics, MEMS and Sensor, Power and Analog Devices and Others (CPU, GPU)], key regions and end user
To provide in-depth information regarding major influencing factors affecting the growth of the market (trends, drivers, restraints, opportunities, and industry-centric and regional challenges)
To strategically analyse the micro-markets and important business segments with respect to individual growth drivers , market trends and potential, and historical contributions to the total market
Identifying the opportunities in the market for key stakeholders and detailing the competitive landscape for market leaders
To provide market size for various segments of the Interposer market with respect to major geographies, namely, South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico)
To strategically profile the key players and analyzing their market shares and core competencies in the Interposer industry
To track key developments such as product launches, expansions, agreements, partnerships, mergers & acquisitions, and R&D activities that are key factors in shaping the market
Available Customization: Data related to EXIM [Export- Import], production & consumption by country or regional level break-up can be provided based on client request**. Additionally, the Players which are also part of the research are Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), Murata Manufacturing Co., Ltd. (Japan), ALLVIA, Inc. (United States), STATS ChipPAC Pte. Ltd. (Singapore) and UTAC Group (Singapore).
** Confirmation on availability of data would be informed prior purchase
While framing the research framework, major and emerging players operating in the Interposer market in various regions have been profiled, and their offerings, geographic footprints, and distribution/sales channels have been analysed through in-depth discussions. The primary research is performed by taking the interviews of executives of various companies dealing in the market as well as using the survey reports, research institute, and latest research reports. Meanwhile, analyst team keeps preparing set of questionnaires and after getting appointee list; the target audience are then tapped and segregated with various mediums and channels that are feasible for making connection that includes email communication, telephonic, skype, LinkedIn Group & InMail, Community Forums, Community Forums, open Survey, SurveyMonkey etc.