Global Molded Interconnect Devices

Molded Interconnect Devices Comprehensive Study by Type (Laser Direct Structuring (LDS), Two-Shot Molding, Others), Application (Hosted Antenna Structures, MEMS Sensor Construction, LED Lighting, Others), Industry Verticals (Automotive, Consumer Products, Healthcare, Industrial, Military & Aerospace, Telecommunication & Computing), Process (Two-Shot Molding Process, Laser Direct Structuring, Metal Spraying, Others) Players and Region - Global Market Outlook to 2030

Molded Interconnect Devices Market by XX Submarkets | Forecast Years 2024-2030 | CAGR: 14.2%  

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  • Summary
  • Market Segments
  • Table of Content
  • List of Table & Figures
  • Players Profiled
Global Molded Interconnect Devices Market Overview:
Molded interconnect devices are injection molded plastic which is part of electromechanical parts used in mechanical and electrical engineering. use 3-dimensional electromechanical parts that bring together the best of both mechanical and electrical engineering. This device consists of the circuit board, connectors, housing, and cables that interfaces ad combines the full function and compact part of the electronic products. It is the three-dimensional thermoplastic carrier creating the real mechatronic device. As per latest study released by AMA Research, the Global Molded Interconnect Devices market is expected to see growth rate of 14.2%

AttributesDetails
Study Period2018-2030
Base Year2023
Forecast Period2024-2030
Historical Period2018-2023
UnitValue (USD Million)
Customization ScopeAvail customization with purchase of this report. Add or modify country, region & or narrow down segments in the final scope subject to feasibility


Influencing Trend:
Emerging Production of Miniature Electronic Products

Market Growth Drivers:
Growing Demand for the Mechanical and Electrical Molded Device for Various Types of Electronics Products and Demand for the Sensor Production for Various Application

Challenges:
Stiff Competition in the Molded Interconnect Devices Market with the Presence of Low-Quality Products

Restraints:
Handling and Complexity Involved in the Production Processing of Molded Interconnect Devices

Opportunities:
The rising Manufacturing Industry will Boost the Molded Interconnect Devices and Surging Production of Medical Products

Competitive Landscape:
The market is seeing moderate market players, by seeing huge growth in this market the key leading vendors are highly focusing on production technologies, efficiency enhancement, and product life. This market has various growth opportunities that leading players capture via tracking the ongoing process enhancement and huge investment in market growth strategies.
Some of the key players profiled in the report are LPKF Laser & Electronics (Germany), TE Connectivity (Switzerland), Molex, LLC (United States), MacDermid, Inc. (United States), Amphenol Corporation (United States), HARTING Technology Group (Switzerland), Select Connect Technologies (United States) and RTP Company, Inc. (United States). Analyst at AMA Research see Global Manufacturers to retain maximum share of Global Molded Interconnect Devices market by 2030. Considering Market by Industry Verticals, the sub-segment i.e. Automotive will boost the Molded Interconnect Devices market. Considering Market by Process, the sub-segment i.e. Two-Shot Molding Process will boost the Molded Interconnect Devices market.

Latest Market Insights:
In April 2022, SABIC launched a glass fiber-reinforced PPS-based compound named LNP THERMOCOMP OFC08V for 5G dipole antennas and other electrical/electronic devices. This compound features laser direct structuring (LDS), a method used to create MIDs.

On 31st March 2021, TactoTek and Amphenol ICC a leading global manufacturer of interconnect products, have announced that they are collaborating to develop automotive-grade in-mold connectors for TactoTek IMSE technology. MSE parts integrate printed electronics and electronic components within 3D injection molded plastics. They combine structure, electronic functions, and cosmetics in a single piece, seamless smart surfaces. TactoTek IMSE parts often connect to external system electronics or host systems.

What Can be Explored with the Molded Interconnect Devices Market Study
 Gain Market Understanding
 Identify Growth Opportunities
 Analyze and Measure the Global Molded Interconnect Devices Market by Identifying Investment across various Industry Verticals
 Understand the Trends that will drive Future Changes in Molded Interconnect Devices
 Understand the Competitive Scenario
- Track Right Markets
- Identify the Right Verticals

Research Methodology:
The top-down and bottom-up approaches are used to estimate and validate the size of the Global Molded Interconnect Devices market.
In order to reach an exhaustive list of functional and relevant players various industry classification standards are closely followed such as NAICS, ICB, SIC to penetrate deep in important geographies by players and a thorough validation test is conducted to reach most relevant players for survey in Molded Interconnect Devices market.
In order to make priority list sorting is done based on revenue generated based on latest reporting with the help of paid databases such as Factiva, Bloomberg etc.
Finally the questionnaire is set and specifically designed to address all the necessities for primary data collection after getting prior appointment by targeting key target audience that includes Molded Interconnect Devices Manufacturers, Molded Interconnect Devices Industry Association, Molded Interconnect Devices International Traders, Research and Development Institutes, Potential Investors, Regulatory Bodies and Others.
This helps us to gather the data related to players revenue, operating cycle and expense, profit along with product or service growth etc.
Almost 70-80% of data is collected through primary medium and further validation is done through various secondary sources that includes Regulators, World Bank, Association, Company Website, SEC filings, OTC BB, USPTO, EPO, Annual reports, press releases etc.

Report Objectives / Segmentation Covered

By Type
  • Laser Direct Structuring (LDS)
  • Two-Shot Molding
  • Others
By Application
  • Hosted Antenna Structures
  • MEMS Sensor Construction
  • LED Lighting
  • Others
By Industry Verticals
  • Automotive
  • Consumer Products
  • Healthcare
  • Industrial
  • Military & Aerospace
  • Telecommunication & Computing

By Process
  • Two-Shot Molding Process
  • Laser Direct Structuring
  • Metal Spraying
  • Others

By Regions
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Taiwan
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • Italy
    • United Kingdom
    • Netherlands
    • Rest of Europe
  • MEA
    • Middle East
    • Africa
  • North America
    • United States
    • Canada
    • Mexico
  • 1. Market Overview
    • 1.1. Introduction
    • 1.2. Scope/Objective of the Study
      • 1.2.1. Research Objective
  • 2. Executive Summary
    • 2.1. Introduction
  • 3. Market Dynamics
    • 3.1. Introduction
    • 3.2. Market Drivers
      • 3.2.1. Growing Demand for the Mechanical and Electrical Molded Device for Various Types of Electronics Products
      • 3.2.2. Demand for the Sensor Production for Various Application
    • 3.3. Market Challenges
      • 3.3.1. Stiff Competition in the Molded Interconnect Devices Market with the Presence of Low-Quality Products
    • 3.4. Market Trends
      • 3.4.1. Emerging Production of Miniature Electronic Products
  • 4. Market Factor Analysis
    • 4.1. Porters Five Forces
    • 4.2. Supply/Value Chain
    • 4.3. PESTEL analysis
    • 4.4. Market Entropy
    • 4.5. Patent/Trademark Analysis
  • 5. Global Molded Interconnect Devices, by Type, Application, Industry Verticals, Process and Region (value) (2018-2023)
    • 5.1. Introduction
    • 5.2. Global Molded Interconnect Devices (Value)
      • 5.2.1. Global Molded Interconnect Devices by: Type (Value)
        • 5.2.1.1. Laser Direct Structuring (LDS)
        • 5.2.1.2. Two-Shot Molding
        • 5.2.1.3. Others
      • 5.2.2. Global Molded Interconnect Devices by: Application (Value)
        • 5.2.2.1. Hosted Antenna Structures
        • 5.2.2.2. MEMS Sensor Construction
        • 5.2.2.3. LED Lighting
        • 5.2.2.4. Others
      • 5.2.3. Global Molded Interconnect Devices by: Industry Verticals (Value)
        • 5.2.3.1. Automotive
        • 5.2.3.2. Consumer Products
        • 5.2.3.3. Healthcare
        • 5.2.3.4. Industrial
        • 5.2.3.5. Military & Aerospace
        • 5.2.3.6. Telecommunication & Computing
      • 5.2.4. Global Molded Interconnect Devices by: Process (Value)
        • 5.2.4.1. Two-Shot Molding Process
        • 5.2.4.2. Laser Direct Structuring
        • 5.2.4.3. Metal Spraying
        • 5.2.4.4. Others
      • 5.2.5. Global Molded Interconnect Devices Region
        • 5.2.5.1. South America
          • 5.2.5.1.1. Brazil
          • 5.2.5.1.2. Argentina
          • 5.2.5.1.3. Rest of South America
        • 5.2.5.2. Asia Pacific
          • 5.2.5.2.1. China
          • 5.2.5.2.2. Japan
          • 5.2.5.2.3. India
          • 5.2.5.2.4. South Korea
          • 5.2.5.2.5. Taiwan
          • 5.2.5.2.6. Australia
          • 5.2.5.2.7. Rest of Asia-Pacific
        • 5.2.5.3. Europe
          • 5.2.5.3.1. Germany
          • 5.2.5.3.2. France
          • 5.2.5.3.3. Italy
          • 5.2.5.3.4. United Kingdom
          • 5.2.5.3.5. Netherlands
          • 5.2.5.3.6. Rest of Europe
        • 5.2.5.4. MEA
          • 5.2.5.4.1. Middle East
          • 5.2.5.4.2. Africa
        • 5.2.5.5. North America
          • 5.2.5.5.1. United States
          • 5.2.5.5.2. Canada
          • 5.2.5.5.3. Mexico
  • 6. Molded Interconnect Devices: Manufacturers/Players Analysis
    • 6.1. Competitive Landscape
      • 6.1.1. Market Share Analysis
        • 6.1.1.1. Top 3
        • 6.1.1.2. Top 5
    • 6.2. Peer Group Analysis (2023)
    • 6.3. BCG Matrix
    • 6.4. Company Profile
      • 6.4.1. LPKF Laser & Electronics (Germany)
        • 6.4.1.1. Business Overview
        • 6.4.1.2. Products/Services Offerings
        • 6.4.1.3. Financial Analysis
        • 6.4.1.4. SWOT Analysis
      • 6.4.2. TE Connectivity (Switzerland)
        • 6.4.2.1. Business Overview
        • 6.4.2.2. Products/Services Offerings
        • 6.4.2.3. Financial Analysis
        • 6.4.2.4. SWOT Analysis
      • 6.4.3. Molex, LLC (United States)
        • 6.4.3.1. Business Overview
        • 6.4.3.2. Products/Services Offerings
        • 6.4.3.3. Financial Analysis
        • 6.4.3.4. SWOT Analysis
      • 6.4.4. MacDermid, Inc. (United States)
        • 6.4.4.1. Business Overview
        • 6.4.4.2. Products/Services Offerings
        • 6.4.4.3. Financial Analysis
        • 6.4.4.4. SWOT Analysis
      • 6.4.5. Amphenol Corporation (United States)
        • 6.4.5.1. Business Overview
        • 6.4.5.2. Products/Services Offerings
        • 6.4.5.3. Financial Analysis
        • 6.4.5.4. SWOT Analysis
      • 6.4.6. HARTING Technology Group (Switzerland)
        • 6.4.6.1. Business Overview
        • 6.4.6.2. Products/Services Offerings
        • 6.4.6.3. Financial Analysis
        • 6.4.6.4. SWOT Analysis
      • 6.4.7. Select Connect Technologies (United States)
        • 6.4.7.1. Business Overview
        • 6.4.7.2. Products/Services Offerings
        • 6.4.7.3. Financial Analysis
        • 6.4.7.4. SWOT Analysis
      • 6.4.8. RTP Company, Inc. (United States)
        • 6.4.8.1. Business Overview
        • 6.4.8.2. Products/Services Offerings
        • 6.4.8.3. Financial Analysis
        • 6.4.8.4. SWOT Analysis
  • 7. Global Molded Interconnect Devices Sale, by Type, Application, Industry Verticals, Process and Region (value) (2025-2030)
    • 7.1. Introduction
    • 7.2. Global Molded Interconnect Devices (Value)
      • 7.2.1. Global Molded Interconnect Devices by: Type (Value)
        • 7.2.1.1. Laser Direct Structuring (LDS)
        • 7.2.1.2. Two-Shot Molding
        • 7.2.1.3. Others
      • 7.2.2. Global Molded Interconnect Devices by: Application (Value)
        • 7.2.2.1. Hosted Antenna Structures
        • 7.2.2.2. MEMS Sensor Construction
        • 7.2.2.3. LED Lighting
        • 7.2.2.4. Others
      • 7.2.3. Global Molded Interconnect Devices by: Industry Verticals (Value)
        • 7.2.3.1. Automotive
        • 7.2.3.2. Consumer Products
        • 7.2.3.3. Healthcare
        • 7.2.3.4. Industrial
        • 7.2.3.5. Military & Aerospace
        • 7.2.3.6. Telecommunication & Computing
      • 7.2.4. Global Molded Interconnect Devices by: Process (Value)
        • 7.2.4.1. Two-Shot Molding Process
        • 7.2.4.2. Laser Direct Structuring
        • 7.2.4.3. Metal Spraying
        • 7.2.4.4. Others
      • 7.2.5. Global Molded Interconnect Devices Region
        • 7.2.5.1. South America
          • 7.2.5.1.1. Brazil
          • 7.2.5.1.2. Argentina
          • 7.2.5.1.3. Rest of South America
        • 7.2.5.2. Asia Pacific
          • 7.2.5.2.1. China
          • 7.2.5.2.2. Japan
          • 7.2.5.2.3. India
          • 7.2.5.2.4. South Korea
          • 7.2.5.2.5. Taiwan
          • 7.2.5.2.6. Australia
          • 7.2.5.2.7. Rest of Asia-Pacific
        • 7.2.5.3. Europe
          • 7.2.5.3.1. Germany
          • 7.2.5.3.2. France
          • 7.2.5.3.3. Italy
          • 7.2.5.3.4. United Kingdom
          • 7.2.5.3.5. Netherlands
          • 7.2.5.3.6. Rest of Europe
        • 7.2.5.4. MEA
          • 7.2.5.4.1. Middle East
          • 7.2.5.4.2. Africa
        • 7.2.5.5. North America
          • 7.2.5.5.1. United States
          • 7.2.5.5.2. Canada
          • 7.2.5.5.3. Mexico
  • 8. Appendix
    • 8.1. Acronyms
  • 9. Methodology and Data Source
    • 9.1. Methodology/Research Approach
      • 9.1.1. Research Programs/Design
      • 9.1.2. Market Size Estimation
      • 9.1.3. Market Breakdown and Data Triangulation
    • 9.2. Data Source
      • 9.2.1. Secondary Sources
      • 9.2.2. Primary Sources
    • 9.3. Disclaimer
List of Tables
  • Table 1. Molded Interconnect Devices: by Type(USD Million)
  • Table 2. Molded Interconnect Devices Laser Direct Structuring (LDS) , by Region USD Million (2018-2023)
  • Table 3. Molded Interconnect Devices Two-Shot Molding , by Region USD Million (2018-2023)
  • Table 4. Molded Interconnect Devices Others , by Region USD Million (2018-2023)
  • Table 5. Molded Interconnect Devices: by Application(USD Million)
  • Table 6. Molded Interconnect Devices Hosted Antenna Structures , by Region USD Million (2018-2023)
  • Table 7. Molded Interconnect Devices MEMS Sensor Construction , by Region USD Million (2018-2023)
  • Table 8. Molded Interconnect Devices LED Lighting , by Region USD Million (2018-2023)
  • Table 9. Molded Interconnect Devices Others , by Region USD Million (2018-2023)
  • Table 10. Molded Interconnect Devices: by Industry Verticals(USD Million)
  • Table 11. Molded Interconnect Devices Automotive , by Region USD Million (2018-2023)
  • Table 12. Molded Interconnect Devices Consumer Products , by Region USD Million (2018-2023)
  • Table 13. Molded Interconnect Devices Healthcare , by Region USD Million (2018-2023)
  • Table 14. Molded Interconnect Devices Industrial , by Region USD Million (2018-2023)
  • Table 15. Molded Interconnect Devices Military & Aerospace , by Region USD Million (2018-2023)
  • Table 16. Molded Interconnect Devices Telecommunication & Computing , by Region USD Million (2018-2023)
  • Table 17. Molded Interconnect Devices: by Process(USD Million)
  • Table 18. Molded Interconnect Devices Two-Shot Molding Process , by Region USD Million (2018-2023)
  • Table 19. Molded Interconnect Devices Laser Direct Structuring , by Region USD Million (2018-2023)
  • Table 20. Molded Interconnect Devices Metal Spraying , by Region USD Million (2018-2023)
  • Table 21. Molded Interconnect Devices Others , by Region USD Million (2018-2023)
  • Table 22. South America Molded Interconnect Devices, by Country USD Million (2018-2023)
  • Table 23. South America Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 24. South America Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 25. South America Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 26. South America Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 27. Brazil Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 28. Brazil Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 29. Brazil Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 30. Brazil Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 31. Argentina Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 32. Argentina Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 33. Argentina Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 34. Argentina Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 35. Rest of South America Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 36. Rest of South America Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 37. Rest of South America Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 38. Rest of South America Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 39. Asia Pacific Molded Interconnect Devices, by Country USD Million (2018-2023)
  • Table 40. Asia Pacific Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 41. Asia Pacific Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 42. Asia Pacific Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 43. Asia Pacific Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 44. China Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 45. China Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 46. China Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 47. China Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 48. Japan Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 49. Japan Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 50. Japan Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 51. Japan Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 52. India Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 53. India Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 54. India Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 55. India Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 56. South Korea Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 57. South Korea Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 58. South Korea Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 59. South Korea Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 60. Taiwan Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 61. Taiwan Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 62. Taiwan Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 63. Taiwan Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 64. Australia Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 65. Australia Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 66. Australia Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 67. Australia Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 68. Rest of Asia-Pacific Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 69. Rest of Asia-Pacific Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 70. Rest of Asia-Pacific Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 71. Rest of Asia-Pacific Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 72. Europe Molded Interconnect Devices, by Country USD Million (2018-2023)
  • Table 73. Europe Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 74. Europe Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 75. Europe Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 76. Europe Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 77. Germany Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 78. Germany Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 79. Germany Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 80. Germany Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 81. France Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 82. France Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 83. France Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 84. France Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 85. Italy Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 86. Italy Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 87. Italy Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 88. Italy Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 89. United Kingdom Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 90. United Kingdom Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 91. United Kingdom Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 92. United Kingdom Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 93. Netherlands Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 94. Netherlands Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 95. Netherlands Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 96. Netherlands Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 97. Rest of Europe Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 98. Rest of Europe Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 99. Rest of Europe Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 100. Rest of Europe Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 101. MEA Molded Interconnect Devices, by Country USD Million (2018-2023)
  • Table 102. MEA Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 103. MEA Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 104. MEA Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 105. MEA Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 106. Middle East Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 107. Middle East Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 108. Middle East Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 109. Middle East Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 110. Africa Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 111. Africa Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 112. Africa Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 113. Africa Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 114. North America Molded Interconnect Devices, by Country USD Million (2018-2023)
  • Table 115. North America Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 116. North America Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 117. North America Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 118. North America Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 119. United States Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 120. United States Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 121. United States Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 122. United States Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 123. Canada Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 124. Canada Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 125. Canada Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 126. Canada Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 127. Mexico Molded Interconnect Devices, by Type USD Million (2018-2023)
  • Table 128. Mexico Molded Interconnect Devices, by Application USD Million (2018-2023)
  • Table 129. Mexico Molded Interconnect Devices, by Industry Verticals USD Million (2018-2023)
  • Table 130. Mexico Molded Interconnect Devices, by Process USD Million (2018-2023)
  • Table 131. Company Basic Information, Sales Area and Its Competitors
  • Table 132. Company Basic Information, Sales Area and Its Competitors
  • Table 133. Company Basic Information, Sales Area and Its Competitors
  • Table 134. Company Basic Information, Sales Area and Its Competitors
  • Table 135. Company Basic Information, Sales Area and Its Competitors
  • Table 136. Company Basic Information, Sales Area and Its Competitors
  • Table 137. Company Basic Information, Sales Area and Its Competitors
  • Table 138. Company Basic Information, Sales Area and Its Competitors
  • Table 139. Molded Interconnect Devices: by Type(USD Million)
  • Table 140. Molded Interconnect Devices Laser Direct Structuring (LDS) , by Region USD Million (2025-2030)
  • Table 141. Molded Interconnect Devices Two-Shot Molding , by Region USD Million (2025-2030)
  • Table 142. Molded Interconnect Devices Others , by Region USD Million (2025-2030)
  • Table 143. Molded Interconnect Devices: by Application(USD Million)
  • Table 144. Molded Interconnect Devices Hosted Antenna Structures , by Region USD Million (2025-2030)
  • Table 145. Molded Interconnect Devices MEMS Sensor Construction , by Region USD Million (2025-2030)
  • Table 146. Molded Interconnect Devices LED Lighting , by Region USD Million (2025-2030)
  • Table 147. Molded Interconnect Devices Others , by Region USD Million (2025-2030)
  • Table 148. Molded Interconnect Devices: by Industry Verticals(USD Million)
  • Table 149. Molded Interconnect Devices Automotive , by Region USD Million (2025-2030)
  • Table 150. Molded Interconnect Devices Consumer Products , by Region USD Million (2025-2030)
  • Table 151. Molded Interconnect Devices Healthcare , by Region USD Million (2025-2030)
  • Table 152. Molded Interconnect Devices Industrial , by Region USD Million (2025-2030)
  • Table 153. Molded Interconnect Devices Military & Aerospace , by Region USD Million (2025-2030)
  • Table 154. Molded Interconnect Devices Telecommunication & Computing , by Region USD Million (2025-2030)
  • Table 155. Molded Interconnect Devices: by Process(USD Million)
  • Table 156. Molded Interconnect Devices Two-Shot Molding Process , by Region USD Million (2025-2030)
  • Table 157. Molded Interconnect Devices Laser Direct Structuring , by Region USD Million (2025-2030)
  • Table 158. Molded Interconnect Devices Metal Spraying , by Region USD Million (2025-2030)
  • Table 159. Molded Interconnect Devices Others , by Region USD Million (2025-2030)
  • Table 160. South America Molded Interconnect Devices, by Country USD Million (2025-2030)
  • Table 161. South America Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 162. South America Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 163. South America Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 164. South America Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 165. Brazil Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 166. Brazil Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 167. Brazil Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 168. Brazil Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 169. Argentina Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 170. Argentina Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 171. Argentina Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 172. Argentina Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 173. Rest of South America Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 174. Rest of South America Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 175. Rest of South America Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 176. Rest of South America Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 177. Asia Pacific Molded Interconnect Devices, by Country USD Million (2025-2030)
  • Table 178. Asia Pacific Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 179. Asia Pacific Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 180. Asia Pacific Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 181. Asia Pacific Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 182. China Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 183. China Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 184. China Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 185. China Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 186. Japan Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 187. Japan Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 188. Japan Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 189. Japan Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 190. India Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 191. India Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 192. India Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 193. India Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 194. South Korea Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 195. South Korea Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 196. South Korea Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 197. South Korea Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 198. Taiwan Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 199. Taiwan Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 200. Taiwan Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 201. Taiwan Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 202. Australia Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 203. Australia Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 204. Australia Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 205. Australia Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 206. Rest of Asia-Pacific Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 207. Rest of Asia-Pacific Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 208. Rest of Asia-Pacific Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 209. Rest of Asia-Pacific Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 210. Europe Molded Interconnect Devices, by Country USD Million (2025-2030)
  • Table 211. Europe Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 212. Europe Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 213. Europe Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 214. Europe Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 215. Germany Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 216. Germany Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 217. Germany Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 218. Germany Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 219. France Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 220. France Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 221. France Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 222. France Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 223. Italy Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 224. Italy Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 225. Italy Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 226. Italy Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 227. United Kingdom Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 228. United Kingdom Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 229. United Kingdom Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 230. United Kingdom Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 231. Netherlands Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 232. Netherlands Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 233. Netherlands Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 234. Netherlands Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 235. Rest of Europe Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 236. Rest of Europe Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 237. Rest of Europe Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 238. Rest of Europe Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 239. MEA Molded Interconnect Devices, by Country USD Million (2025-2030)
  • Table 240. MEA Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 241. MEA Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 242. MEA Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 243. MEA Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 244. Middle East Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 245. Middle East Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 246. Middle East Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 247. Middle East Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 248. Africa Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 249. Africa Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 250. Africa Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 251. Africa Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 252. North America Molded Interconnect Devices, by Country USD Million (2025-2030)
  • Table 253. North America Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 254. North America Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 255. North America Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 256. North America Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 257. United States Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 258. United States Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 259. United States Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 260. United States Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 261. Canada Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 262. Canada Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 263. Canada Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 264. Canada Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 265. Mexico Molded Interconnect Devices, by Type USD Million (2025-2030)
  • Table 266. Mexico Molded Interconnect Devices, by Application USD Million (2025-2030)
  • Table 267. Mexico Molded Interconnect Devices, by Industry Verticals USD Million (2025-2030)
  • Table 268. Mexico Molded Interconnect Devices, by Process USD Million (2025-2030)
  • Table 269. Research Programs/Design for This Report
  • Table 270. Key Data Information from Secondary Sources
  • Table 271. Key Data Information from Primary Sources
List of Figures
  • Figure 1. Porters Five Forces
  • Figure 2. Supply/Value Chain
  • Figure 3. PESTEL analysis
  • Figure 4. Global Molded Interconnect Devices: by Type USD Million (2018-2023)
  • Figure 5. Global Molded Interconnect Devices: by Application USD Million (2018-2023)
  • Figure 6. Global Molded Interconnect Devices: by Industry Verticals USD Million (2018-2023)
  • Figure 7. Global Molded Interconnect Devices: by Process USD Million (2018-2023)
  • Figure 8. South America Molded Interconnect Devices Share (%), by Country
  • Figure 9. Asia Pacific Molded Interconnect Devices Share (%), by Country
  • Figure 10. Europe Molded Interconnect Devices Share (%), by Country
  • Figure 11. MEA Molded Interconnect Devices Share (%), by Country
  • Figure 12. North America Molded Interconnect Devices Share (%), by Country
  • Figure 13. Global Molded Interconnect Devices share by Players 2023 (%)
  • Figure 14. Global Molded Interconnect Devices share by Players (Top 3) 2023(%)
  • Figure 15. Global Molded Interconnect Devices share by Players (Top 5) 2023(%)
  • Figure 16. BCG Matrix for key Companies
  • Figure 17. LPKF Laser & Electronics (Germany) Revenue, Net Income and Gross profit
  • Figure 18. LPKF Laser & Electronics (Germany) Revenue: by Geography 2023
  • Figure 19. TE Connectivity (Switzerland) Revenue, Net Income and Gross profit
  • Figure 20. TE Connectivity (Switzerland) Revenue: by Geography 2023
  • Figure 21. Molex, LLC (United States) Revenue, Net Income and Gross profit
  • Figure 22. Molex, LLC (United States) Revenue: by Geography 2023
  • Figure 23. MacDermid, Inc. (United States) Revenue, Net Income and Gross profit
  • Figure 24. MacDermid, Inc. (United States) Revenue: by Geography 2023
  • Figure 25. Amphenol Corporation (United States) Revenue, Net Income and Gross profit
  • Figure 26. Amphenol Corporation (United States) Revenue: by Geography 2023
  • Figure 27. HARTING Technology Group (Switzerland) Revenue, Net Income and Gross profit
  • Figure 28. HARTING Technology Group (Switzerland) Revenue: by Geography 2023
  • Figure 29. Select Connect Technologies (United States) Revenue, Net Income and Gross profit
  • Figure 30. Select Connect Technologies (United States) Revenue: by Geography 2023
  • Figure 31. RTP Company, Inc. (United States) Revenue, Net Income and Gross profit
  • Figure 32. RTP Company, Inc. (United States) Revenue: by Geography 2023
  • Figure 33. Global Molded Interconnect Devices: by Type USD Million (2025-2030)
  • Figure 34. Global Molded Interconnect Devices: by Application USD Million (2025-2030)
  • Figure 35. Global Molded Interconnect Devices: by Industry Verticals USD Million (2025-2030)
  • Figure 36. Global Molded Interconnect Devices: by Process USD Million (2025-2030)
  • Figure 37. South America Molded Interconnect Devices Share (%), by Country
  • Figure 38. Asia Pacific Molded Interconnect Devices Share (%), by Country
  • Figure 39. Europe Molded Interconnect Devices Share (%), by Country
  • Figure 40. MEA Molded Interconnect Devices Share (%), by Country
  • Figure 41. North America Molded Interconnect Devices Share (%), by Country
List of companies from research coverage that are profiled in the study
  • LPKF Laser & Electronics (Germany)
  • TE Connectivity (Switzerland)
  • Molex, LLC (United States)
  • MacDermid, Inc. (United States)
  • Amphenol Corporation (United States)
  • HARTING Technology Group (Switzerland)
  • Select Connect Technologies (United States)
  • RTP Company, Inc. (United States)
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Key Highlights of Report


Apr 2024 241 Pages 79 Tables Base Year: 2023 Coverage: 15+ Companies; 18 Countries

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Global Molded Interconnect Devices Quantitative research analysis
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Frequently Asked Questions (FAQ):

Top performing companies in the Global Molded Interconnect Devices market are LPKF Laser & Electronics (Germany), TE Connectivity (Switzerland), Molex, LLC (United States), MacDermid, Inc. (United States), Amphenol Corporation (United States), HARTING Technology Group (Switzerland), Select Connect Technologies (United States) and RTP Company, Inc. (United States), to name a few.
"Emerging Production of Miniature Electronic Products" is seen as one of major influencing trends for Molded Interconnect Devices Market during projected period 2023-2030.
Laser Direct Structuring (LDS) segment in Global market to hold robust market share owing to "Growing Demand for the Mechanical and Electrical Molded Device for Various Types of Electronics Products ".

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