Global Semiconductor Packaging

Semiconductor Packaging Comprehensive Study by Type (Flip Chip, Embedded Die, Wafer Level Packaging, Wirebond Packaging, Others), Industry Vertical (Automotive Industry, Aerospace and Defense, Telecommunication, Consumer Electronics, Medical Devices, Energy and Lighting), Device Type (Analog & Mixed-Signal, Wireless Connectivity, Optoelectronic, MEMS & Sensor, Misc Logic and Memory, Others) Players and Region - Global Market Outlook to 2026

Semiconductor Packaging Market by XX Submarkets | Forecast Years 2022-2027  

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  • Summary
  • Market Segments
  • Table of Content
  • List of Table & Figures
  • Players Profiled
Industry Background:
A semiconductor package is a metal, plastic, glass or ceramic casing containing one or more semiconductor electronic components. Semiconductor packaging technology has evolved to minimize the costs involved and enhance the overall efficacy of ICs. The market players in the market are under constant pressure to deliver innovative solutions in terms of the size of the packaging, performance, and the “time-to-market” aspect.This growth is primarily driven by Increasing Consumption of Semiconductor Devices Across Industries and Growing Need for Miniaturization of Semiconductor Devices across the World.

Globally, a noticeable market trend is evident Growing Trend of Internet of Things, Artificial Intelligence Technology . Major Players, such as ASE Group (Taiwan), Amkor Technology, Inc. (United States), Siliconware Precision Industries (Taiwan), STATS ChipPAC (Singapore), Powertech Technology Inc. (Taiwan), Nordson Corporation (United States), Formosa Packaging (United States), JCET Group Co. Ltd. (China), UTAC Group (Singapore), ChipMOS Technology (Taiwan), Chipbond Technology Corporation (Taiwan) and MICROSS STS (United States) etc have either set up their manufacturing facilities or are planning to start new provision in the dominated region in the upcoming years.

Regulatory Insights:
"Although the United States has no all-encompassing federal legislation regulating the packaging industry, the federal government has asserted its authority to regulate food, drug, and cosmetic packaging to preserve consumer safety and confidence. There have also been a number of regulatory programs introduced by states or local jurisdictions to reduce the use and disposal of certain packaging materials and mandate minimum recycling requirements. Here we summarize some current regulations – issued at both a federal and state-level – that have impacted several sectors of the packaging industry."

Market Drivers
  • Increasing Consumption of Semiconductor Devices Across Industries
  • Growing Need for Miniaturization of Semiconductor Devices across the World

Market Trend
  • Growing Trend of Internet of Things, Artificial Intelligence Technology
  • The Advent of Advanced Packaging Technology

Restraints
  • Huge Initial Investment and Growing Complexities Various Semiconductor Designs

Opportunities
Rapid Growth Portable Electronics and Wearable Device Market and High Adoption Rate of Consumer Electronics across the World

AMA Research follow a focused and realistic research framework that provides the ability to study the crucial market dynamics in several regions across the world. Moreover, an in-depth assessment is mostly conducted by our analysts on geographical regions to provide clients and businesses the opportunity to dominate in niche markets and expand in emerging markets across the globe. This market research study also showcase the spontaneously changing Players landscape impacting the growth of the market. Furthermore, our market researchers extensively analyse the products and services offered by multiple players competing to increase their market share and presence.

Customization in the Report
AMA Research features not only specific market forecasts, but also include significant value-added commentary on:
- Market Trends
- Technological Trends and Innovations
- Market Maturity Indicators
- Growth Drivers and Constraints
- New Entrants into the Market & Entry/Exit Barriers
- To Seize Powerful Market Opportunities
- Identify Key Business Segments, Market Proposition & Gap Analysis

Against this Challenging Backdrop, Semiconductor Packaging Study Sheds Light on
— The Semiconductor Packaging Market status quo and key characteristics. To end this, Analyst at AMA organize and took survey of the Semiconductor Packaging industry Players. The resultant snapshot serves as a basis for understanding why and how the industry can be expected to change.
— Where Semiconductor Packaging industry is heading and what are the top priorities. Insights are drawn from financial analysis, the survey and interviews with key executives and industry experts.
— How every company in this diverse set of Players can best navigate the emerging competition landscape and follow a strategy that helps them position to hold value they currently claim, or capture the new addressable opportunity.

Report Objectives / Segmentation Covered

By Type
  • Flip Chip
  • Embedded Die
  • Wafer Level Packaging
  • Wirebond Packaging
  • Others
By Industry Vertical
  • Automotive Industry
  • Aerospace and Defense
  • Telecommunication
  • Consumer Electronics
  • Medical Devices
  • Energy and Lighting

By Device Type
  • Analog & Mixed-Signal
  • Wireless Connectivity
  • Optoelectronic
  • MEMS & Sensor
  • Misc Logic and Memory
  • Others

By Regions
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Taiwan
    • Australia
    • Rest of Asia-Pacific
  • Europe
    • Germany
    • France
    • Italy
    • United Kingdom
    • Netherlands
    • Rest of Europe
  • MEA
    • Middle East
    • Africa
  • North America
    • United States
    • Canada
    • Mexico
  • 1. Market Overview
    • 1.1. Introduction
    • 1.2. Scope/Objective of the Study
      • 1.2.1. Research Objective
  • 2. Executive Summary
    • 2.1. Introduction
  • 3. Market Dynamics
    • 3.1. Introduction
    • 3.2. Market Drivers
      • 3.2.1. Increasing Consumption of Semiconductor Devices Across Industries
      • 3.2.2. Growing Need for Miniaturization of Semiconductor Devices across the World
    • 3.3. Market Trends
      • 3.3.1. Growing Trend of Internet of Things, Artificial Intelligence Technology
      • 3.3.2. The Advent of Advanced Packaging Technology
  • 4. Market Factor Analysis
    • 4.1. Porters Five Forces
    • 4.2. Supply/Value Chain
    • 4.3. PESTEL analysis
    • 4.4. Market Entropy
    • 4.5. Patent/Trademark Analysis
  • 5. Global Semiconductor Packaging, by Type, Industry Vertical, Device Type and Region (value and price ) (2015-2020)
    • 5.1. Introduction
    • 5.2. Global Semiconductor Packaging (Value)
      • 5.2.1. Global Semiconductor Packaging by: Type (Value)
        • 5.2.1.1. Flip Chip
        • 5.2.1.2. Embedded Die
        • 5.2.1.3. Wafer Level Packaging
        • 5.2.1.4. Wirebond Packaging
        • 5.2.1.5. Others
      • 5.2.2. Global Semiconductor Packaging by: Industry Vertical (Value)
        • 5.2.2.1. Automotive Industry
        • 5.2.2.2. Aerospace and Defense
        • 5.2.2.3. Telecommunication
        • 5.2.2.4. Consumer Electronics
        • 5.2.2.5. Medical Devices
        • 5.2.2.6. Energy and Lighting
      • 5.2.3. Global Semiconductor Packaging by: Device Type (Value)
        • 5.2.3.1. Analog & Mixed-Signal
        • 5.2.3.2. Wireless Connectivity
        • 5.2.3.3. Optoelectronic
        • 5.2.3.4. MEMS & Sensor
        • 5.2.3.5. Misc Logic and Memory
        • 5.2.3.6. Others
      • 5.2.4. Global Semiconductor Packaging Region
        • 5.2.4.1. South America
          • 5.2.4.1.1. Brazil
          • 5.2.4.1.2. Argentina
          • 5.2.4.1.3. Rest of South America
        • 5.2.4.2. Asia Pacific
          • 5.2.4.2.1. China
          • 5.2.4.2.2. Japan
          • 5.2.4.2.3. India
          • 5.2.4.2.4. South Korea
          • 5.2.4.2.5. Taiwan
          • 5.2.4.2.6. Australia
          • 5.2.4.2.7. Rest of Asia-Pacific
        • 5.2.4.3. Europe
          • 5.2.4.3.1. Germany
          • 5.2.4.3.2. France
          • 5.2.4.3.3. Italy
          • 5.2.4.3.4. United Kingdom
          • 5.2.4.3.5. Netherlands
          • 5.2.4.3.6. Rest of Europe
        • 5.2.4.4. MEA
          • 5.2.4.4.1. Middle East
          • 5.2.4.4.2. Africa
        • 5.2.4.5. North America
          • 5.2.4.5.1. United States
          • 5.2.4.5.2. Canada
          • 5.2.4.5.3. Mexico
    • 5.3. Global Semiconductor Packaging (Price)
      • 5.3.1. Global Semiconductor Packaging by: Type (Price)
  • 6. Semiconductor Packaging: Manufacturers/Players Analysis
    • 6.1. Competitive Landscape
      • 6.1.1. Market Share Analysis
        • 6.1.1.1. Top 3
        • 6.1.1.2. Top 5
    • 6.2. Peer Group Analysis (2020)
    • 6.3. BCG Matrix
    • 6.4. Company Profile
      • 6.4.1. ASE Group (Taiwan)
        • 6.4.1.1. Business Overview
        • 6.4.1.2. Products/Services Offerings
        • 6.4.1.3. Financial Analysis
        • 6.4.1.4. SWOT Analysis
      • 6.4.2. Amkor Technology, Inc. (United States)
        • 6.4.2.1. Business Overview
        • 6.4.2.2. Products/Services Offerings
        • 6.4.2.3. Financial Analysis
        • 6.4.2.4. SWOT Analysis
      • 6.4.3. Siliconware Precision Industries (Taiwan)
        • 6.4.3.1. Business Overview
        • 6.4.3.2. Products/Services Offerings
        • 6.4.3.3. Financial Analysis
        • 6.4.3.4. SWOT Analysis
      • 6.4.4. STATS ChipPAC (Singapore)
        • 6.4.4.1. Business Overview
        • 6.4.4.2. Products/Services Offerings
        • 6.4.4.3. Financial Analysis
        • 6.4.4.4. SWOT Analysis
      • 6.4.5. Powertech Technology Inc. (Taiwan)
        • 6.4.5.1. Business Overview
        • 6.4.5.2. Products/Services Offerings
        • 6.4.5.3. Financial Analysis
        • 6.4.5.4. SWOT Analysis
      • 6.4.6. Nordson Corporation (United States)
        • 6.4.6.1. Business Overview
        • 6.4.6.2. Products/Services Offerings
        • 6.4.6.3. Financial Analysis
        • 6.4.6.4. SWOT Analysis
      • 6.4.7. Formosa Packaging (United States)
        • 6.4.7.1. Business Overview
        • 6.4.7.2. Products/Services Offerings
        • 6.4.7.3. Financial Analysis
        • 6.4.7.4. SWOT Analysis
      • 6.4.8. JCET Group Co. Ltd. (China)
        • 6.4.8.1. Business Overview
        • 6.4.8.2. Products/Services Offerings
        • 6.4.8.3. Financial Analysis
        • 6.4.8.4. SWOT Analysis
      • 6.4.9. UTAC Group (Singapore)
        • 6.4.9.1. Business Overview
        • 6.4.9.2. Products/Services Offerings
        • 6.4.9.3. Financial Analysis
        • 6.4.9.4. SWOT Analysis
      • 6.4.10. ChipMOS Technology (Taiwan)
        • 6.4.10.1. Business Overview
        • 6.4.10.2. Products/Services Offerings
        • 6.4.10.3. Financial Analysis
        • 6.4.10.4. SWOT Analysis
      • 6.4.11. Chipbond Technology Corporation (Taiwan)
        • 6.4.11.1. Business Overview
        • 6.4.11.2. Products/Services Offerings
        • 6.4.11.3. Financial Analysis
        • 6.4.11.4. SWOT Analysis
      • 6.4.12. MICROSS STS (United States)
        • 6.4.12.1. Business Overview
        • 6.4.12.2. Products/Services Offerings
        • 6.4.12.3. Financial Analysis
        • 6.4.12.4. SWOT Analysis
  • 7. Global Semiconductor Packaging Sale, by Type, Industry Vertical, Device Type and Region (value and price ) (2021-2026)
    • 7.1. Introduction
    • 7.2. Global Semiconductor Packaging (Value)
      • 7.2.1. Global Semiconductor Packaging by: Type (Value)
        • 7.2.1.1. Flip Chip
        • 7.2.1.2. Embedded Die
        • 7.2.1.3. Wafer Level Packaging
        • 7.2.1.4. Wirebond Packaging
        • 7.2.1.5. Others
      • 7.2.2. Global Semiconductor Packaging by: Industry Vertical (Value)
        • 7.2.2.1. Automotive Industry
        • 7.2.2.2. Aerospace and Defense
        • 7.2.2.3. Telecommunication
        • 7.2.2.4. Consumer Electronics
        • 7.2.2.5. Medical Devices
        • 7.2.2.6. Energy and Lighting
      • 7.2.3. Global Semiconductor Packaging by: Device Type (Value)
        • 7.2.3.1. Analog & Mixed-Signal
        • 7.2.3.2. Wireless Connectivity
        • 7.2.3.3. Optoelectronic
        • 7.2.3.4. MEMS & Sensor
        • 7.2.3.5. Misc Logic and Memory
        • 7.2.3.6. Others
      • 7.2.4. Global Semiconductor Packaging Region
        • 7.2.4.1. South America
          • 7.2.4.1.1. Brazil
          • 7.2.4.1.2. Argentina
          • 7.2.4.1.3. Rest of South America
        • 7.2.4.2. Asia Pacific
          • 7.2.4.2.1. China
          • 7.2.4.2.2. Japan
          • 7.2.4.2.3. India
          • 7.2.4.2.4. South Korea
          • 7.2.4.2.5. Taiwan
          • 7.2.4.2.6. Australia
          • 7.2.4.2.7. Rest of Asia-Pacific
        • 7.2.4.3. Europe
          • 7.2.4.3.1. Germany
          • 7.2.4.3.2. France
          • 7.2.4.3.3. Italy
          • 7.2.4.3.4. United Kingdom
          • 7.2.4.3.5. Netherlands
          • 7.2.4.3.6. Rest of Europe
        • 7.2.4.4. MEA
          • 7.2.4.4.1. Middle East
          • 7.2.4.4.2. Africa
        • 7.2.4.5. North America
          • 7.2.4.5.1. United States
          • 7.2.4.5.2. Canada
          • 7.2.4.5.3. Mexico
    • 7.3. Global Semiconductor Packaging (Price)
      • 7.3.1. Global Semiconductor Packaging by: Type (Price)
  • 8. Appendix
    • 8.1. Acronyms
  • 9. Methodology and Data Source
    • 9.1. Methodology/Research Approach
      • 9.1.1. Research Programs/Design
      • 9.1.2. Market Size Estimation
      • 9.1.3. Market Breakdown and Data Triangulation
    • 9.2. Data Source
      • 9.2.1. Secondary Sources
      • 9.2.2. Primary Sources
    • 9.3. Disclaimer
List of Tables
  • Table 1. Semiconductor Packaging: by Type(USD Million)
  • Table 2. Semiconductor Packaging Flip Chip , by Region USD Million (2015-2020)
  • Table 3. Semiconductor Packaging Embedded Die , by Region USD Million (2015-2020)
  • Table 4. Semiconductor Packaging Wafer Level Packaging , by Region USD Million (2015-2020)
  • Table 5. Semiconductor Packaging Wirebond Packaging , by Region USD Million (2015-2020)
  • Table 6. Semiconductor Packaging Others , by Region USD Million (2015-2020)
  • Table 7. Semiconductor Packaging: by Industry Vertical(USD Million)
  • Table 8. Semiconductor Packaging Automotive Industry , by Region USD Million (2015-2020)
  • Table 9. Semiconductor Packaging Aerospace and Defense , by Region USD Million (2015-2020)
  • Table 10. Semiconductor Packaging Telecommunication , by Region USD Million (2015-2020)
  • Table 11. Semiconductor Packaging Consumer Electronics , by Region USD Million (2015-2020)
  • Table 12. Semiconductor Packaging Medical Devices , by Region USD Million (2015-2020)
  • Table 13. Semiconductor Packaging Energy and Lighting , by Region USD Million (2015-2020)
  • Table 14. Semiconductor Packaging: by Device Type(USD Million)
  • Table 15. Semiconductor Packaging Analog & Mixed-Signal , by Region USD Million (2015-2020)
  • Table 16. Semiconductor Packaging Wireless Connectivity , by Region USD Million (2015-2020)
  • Table 17. Semiconductor Packaging Optoelectronic , by Region USD Million (2015-2020)
  • Table 18. Semiconductor Packaging MEMS & Sensor , by Region USD Million (2015-2020)
  • Table 19. Semiconductor Packaging Misc Logic and Memory , by Region USD Million (2015-2020)
  • Table 20. Semiconductor Packaging Others , by Region USD Million (2015-2020)
  • Table 21. South America Semiconductor Packaging, by Country USD Million (2015-2020)
  • Table 22. South America Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 23. South America Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 24. South America Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 25. Brazil Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 26. Brazil Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 27. Brazil Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 28. Argentina Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 29. Argentina Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 30. Argentina Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 31. Rest of South America Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 32. Rest of South America Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 33. Rest of South America Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 34. Asia Pacific Semiconductor Packaging, by Country USD Million (2015-2020)
  • Table 35. Asia Pacific Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 36. Asia Pacific Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 37. Asia Pacific Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 38. China Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 39. China Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 40. China Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 41. Japan Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 42. Japan Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 43. Japan Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 44. India Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 45. India Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 46. India Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 47. South Korea Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 48. South Korea Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 49. South Korea Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 50. Taiwan Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 51. Taiwan Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 52. Taiwan Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 53. Australia Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 54. Australia Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 55. Australia Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 56. Rest of Asia-Pacific Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 57. Rest of Asia-Pacific Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 58. Rest of Asia-Pacific Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 59. Europe Semiconductor Packaging, by Country USD Million (2015-2020)
  • Table 60. Europe Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 61. Europe Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 62. Europe Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 63. Germany Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 64. Germany Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 65. Germany Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 66. France Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 67. France Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 68. France Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 69. Italy Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 70. Italy Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 71. Italy Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 72. United Kingdom Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 73. United Kingdom Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 74. United Kingdom Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 75. Netherlands Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 76. Netherlands Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 77. Netherlands Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 78. Rest of Europe Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 79. Rest of Europe Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 80. Rest of Europe Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 81. MEA Semiconductor Packaging, by Country USD Million (2015-2020)
  • Table 82. MEA Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 83. MEA Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 84. MEA Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 85. Middle East Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 86. Middle East Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 87. Middle East Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 88. Africa Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 89. Africa Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 90. Africa Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 91. North America Semiconductor Packaging, by Country USD Million (2015-2020)
  • Table 92. North America Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 93. North America Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 94. North America Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 95. United States Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 96. United States Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 97. United States Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 98. Canada Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 99. Canada Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 100. Canada Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 101. Mexico Semiconductor Packaging, by Type USD Million (2015-2020)
  • Table 102. Mexico Semiconductor Packaging, by Industry Vertical USD Million (2015-2020)
  • Table 103. Mexico Semiconductor Packaging, by Device Type USD Million (2015-2020)
  • Table 104. Semiconductor Packaging: by Type(USD/Units)
  • Table 105. Company Basic Information, Sales Area and Its Competitors
  • Table 106. Company Basic Information, Sales Area and Its Competitors
  • Table 107. Company Basic Information, Sales Area and Its Competitors
  • Table 108. Company Basic Information, Sales Area and Its Competitors
  • Table 109. Company Basic Information, Sales Area and Its Competitors
  • Table 110. Company Basic Information, Sales Area and Its Competitors
  • Table 111. Company Basic Information, Sales Area and Its Competitors
  • Table 112. Company Basic Information, Sales Area and Its Competitors
  • Table 113. Company Basic Information, Sales Area and Its Competitors
  • Table 114. Company Basic Information, Sales Area and Its Competitors
  • Table 115. Company Basic Information, Sales Area and Its Competitors
  • Table 116. Company Basic Information, Sales Area and Its Competitors
  • Table 117. Semiconductor Packaging: by Type(USD Million)
  • Table 118. Semiconductor Packaging Flip Chip , by Region USD Million (2021-2026)
  • Table 119. Semiconductor Packaging Embedded Die , by Region USD Million (2021-2026)
  • Table 120. Semiconductor Packaging Wafer Level Packaging , by Region USD Million (2021-2026)
  • Table 121. Semiconductor Packaging Wirebond Packaging , by Region USD Million (2021-2026)
  • Table 122. Semiconductor Packaging Others , by Region USD Million (2021-2026)
  • Table 123. Semiconductor Packaging: by Industry Vertical(USD Million)
  • Table 124. Semiconductor Packaging Automotive Industry , by Region USD Million (2021-2026)
  • Table 125. Semiconductor Packaging Aerospace and Defense , by Region USD Million (2021-2026)
  • Table 126. Semiconductor Packaging Telecommunication , by Region USD Million (2021-2026)
  • Table 127. Semiconductor Packaging Consumer Electronics , by Region USD Million (2021-2026)
  • Table 128. Semiconductor Packaging Medical Devices , by Region USD Million (2021-2026)
  • Table 129. Semiconductor Packaging Energy and Lighting , by Region USD Million (2021-2026)
  • Table 130. Semiconductor Packaging: by Device Type(USD Million)
  • Table 131. Semiconductor Packaging Analog & Mixed-Signal , by Region USD Million (2021-2026)
  • Table 132. Semiconductor Packaging Wireless Connectivity , by Region USD Million (2021-2026)
  • Table 133. Semiconductor Packaging Optoelectronic , by Region USD Million (2021-2026)
  • Table 134. Semiconductor Packaging MEMS & Sensor , by Region USD Million (2021-2026)
  • Table 135. Semiconductor Packaging Misc Logic and Memory , by Region USD Million (2021-2026)
  • Table 136. Semiconductor Packaging Others , by Region USD Million (2021-2026)
  • Table 137. South America Semiconductor Packaging, by Country USD Million (2021-2026)
  • Table 138. South America Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 139. South America Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 140. South America Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 141. Brazil Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 142. Brazil Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 143. Brazil Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 144. Argentina Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 145. Argentina Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 146. Argentina Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 147. Rest of South America Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 148. Rest of South America Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 149. Rest of South America Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 150. Asia Pacific Semiconductor Packaging, by Country USD Million (2021-2026)
  • Table 151. Asia Pacific Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 152. Asia Pacific Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 153. Asia Pacific Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 154. China Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 155. China Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 156. China Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 157. Japan Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 158. Japan Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 159. Japan Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 160. India Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 161. India Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 162. India Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 163. South Korea Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 164. South Korea Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 165. South Korea Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 166. Taiwan Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 167. Taiwan Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 168. Taiwan Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 169. Australia Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 170. Australia Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 171. Australia Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 172. Rest of Asia-Pacific Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 173. Rest of Asia-Pacific Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 174. Rest of Asia-Pacific Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 175. Europe Semiconductor Packaging, by Country USD Million (2021-2026)
  • Table 176. Europe Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 177. Europe Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 178. Europe Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 179. Germany Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 180. Germany Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 181. Germany Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 182. France Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 183. France Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 184. France Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 185. Italy Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 186. Italy Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 187. Italy Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 188. United Kingdom Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 189. United Kingdom Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 190. United Kingdom Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 191. Netherlands Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 192. Netherlands Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 193. Netherlands Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 194. Rest of Europe Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 195. Rest of Europe Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 196. Rest of Europe Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 197. MEA Semiconductor Packaging, by Country USD Million (2021-2026)
  • Table 198. MEA Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 199. MEA Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 200. MEA Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 201. Middle East Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 202. Middle East Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 203. Middle East Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 204. Africa Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 205. Africa Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 206. Africa Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 207. North America Semiconductor Packaging, by Country USD Million (2021-2026)
  • Table 208. North America Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 209. North America Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 210. North America Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 211. United States Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 212. United States Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 213. United States Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 214. Canada Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 215. Canada Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 216. Canada Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 217. Mexico Semiconductor Packaging, by Type USD Million (2021-2026)
  • Table 218. Mexico Semiconductor Packaging, by Industry Vertical USD Million (2021-2026)
  • Table 219. Mexico Semiconductor Packaging, by Device Type USD Million (2021-2026)
  • Table 220. Semiconductor Packaging: by Type(USD/Units)
  • Table 221. Research Programs/Design for This Report
  • Table 222. Key Data Information from Secondary Sources
  • Table 223. Key Data Information from Primary Sources
List of Figures
  • Figure 1. Porters Five Forces
  • Figure 2. Supply/Value Chain
  • Figure 3. PESTEL analysis
  • Figure 4. Global Semiconductor Packaging: by Type USD Million (2015-2020)
  • Figure 5. Global Semiconductor Packaging: by Industry Vertical USD Million (2015-2020)
  • Figure 6. Global Semiconductor Packaging: by Device Type USD Million (2015-2020)
  • Figure 7. South America Semiconductor Packaging Share (%), by Country
  • Figure 8. Asia Pacific Semiconductor Packaging Share (%), by Country
  • Figure 9. Europe Semiconductor Packaging Share (%), by Country
  • Figure 10. MEA Semiconductor Packaging Share (%), by Country
  • Figure 11. North America Semiconductor Packaging Share (%), by Country
  • Figure 12. Global Semiconductor Packaging: by Type USD/Units (2015-2020)
  • Figure 13. Global Semiconductor Packaging share by Players 2020 (%)
  • Figure 14. Global Semiconductor Packaging share by Players (Top 3) 2020(%)
  • Figure 15. Global Semiconductor Packaging share by Players (Top 5) 2020(%)
  • Figure 16. BCG Matrix for key Companies
  • Figure 17. ASE Group (Taiwan) Revenue, Net Income and Gross profit
  • Figure 18. ASE Group (Taiwan) Revenue: by Geography 2020
  • Figure 19. Amkor Technology, Inc. (United States) Revenue, Net Income and Gross profit
  • Figure 20. Amkor Technology, Inc. (United States) Revenue: by Geography 2020
  • Figure 21. Siliconware Precision Industries (Taiwan) Revenue, Net Income and Gross profit
  • Figure 22. Siliconware Precision Industries (Taiwan) Revenue: by Geography 2020
  • Figure 23. STATS ChipPAC (Singapore) Revenue, Net Income and Gross profit
  • Figure 24. STATS ChipPAC (Singapore) Revenue: by Geography 2020
  • Figure 25. Powertech Technology Inc. (Taiwan) Revenue, Net Income and Gross profit
  • Figure 26. Powertech Technology Inc. (Taiwan) Revenue: by Geography 2020
  • Figure 27. Nordson Corporation (United States) Revenue, Net Income and Gross profit
  • Figure 28. Nordson Corporation (United States) Revenue: by Geography 2020
  • Figure 29. Formosa Packaging (United States) Revenue, Net Income and Gross profit
  • Figure 30. Formosa Packaging (United States) Revenue: by Geography 2020
  • Figure 31. JCET Group Co. Ltd. (China) Revenue, Net Income and Gross profit
  • Figure 32. JCET Group Co. Ltd. (China) Revenue: by Geography 2020
  • Figure 33. UTAC Group (Singapore) Revenue, Net Income and Gross profit
  • Figure 34. UTAC Group (Singapore) Revenue: by Geography 2020
  • Figure 35. ChipMOS Technology (Taiwan) Revenue, Net Income and Gross profit
  • Figure 36. ChipMOS Technology (Taiwan) Revenue: by Geography 2020
  • Figure 37. Chipbond Technology Corporation (Taiwan) Revenue, Net Income and Gross profit
  • Figure 38. Chipbond Technology Corporation (Taiwan) Revenue: by Geography 2020
  • Figure 39. MICROSS STS (United States) Revenue, Net Income and Gross profit
  • Figure 40. MICROSS STS (United States) Revenue: by Geography 2020
  • Figure 41. Global Semiconductor Packaging: by Type USD Million (2021-2026)
  • Figure 42. Global Semiconductor Packaging: by Industry Vertical USD Million (2021-2026)
  • Figure 43. Global Semiconductor Packaging: by Device Type USD Million (2021-2026)
  • Figure 44. South America Semiconductor Packaging Share (%), by Country
  • Figure 45. Asia Pacific Semiconductor Packaging Share (%), by Country
  • Figure 46. Europe Semiconductor Packaging Share (%), by Country
  • Figure 47. MEA Semiconductor Packaging Share (%), by Country
  • Figure 48. North America Semiconductor Packaging Share (%), by Country
  • Figure 49. Global Semiconductor Packaging: by Type USD/Units (2021-2026)
List of companies from research coverage that are profiled in the study
  • ASE Group (Taiwan)
  • Amkor Technology, Inc. (United States)
  • Siliconware Precision Industries (Taiwan)
  • STATS ChipPAC (Singapore)
  • Powertech Technology Inc. (Taiwan)
  • Nordson Corporation (United States)
  • Formosa Packaging (United States)
  • JCET Group Co. Ltd. (China)
  • UTAC Group (Singapore)
  • ChipMOS Technology (Taiwan)
  • Chipbond Technology Corporation (Taiwan)
  • MICROSS STS (United States)
Additional players considered in the study are as follows:
Tianshui Huatian Technology Co. Ltd. (China) , Carsem (M) Sdn. Bhd. (Malaysia) , Unisem Group (Malaysia) , OSE CORP. (Taiwan) , Walton Advanced Engineering, Inc. (Taiwan) , NEPES Corp (South Korea)
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Global Semiconductor Packaging Quantitative research analysis
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Historical year: 2016-2020; Base year: 2020; Forecast period: 2021 to 2026
Companies that are profiled in Global Semiconductor Packaging Market are ASE Group (Taiwan), Amkor Technology, Inc. (United States), Siliconware Precision Industries (Taiwan), STATS ChipPAC (Singapore), Powertech Technology Inc. (Taiwan), Nordson Corporation (United States), Formosa Packaging (United States), JCET Group Co. Ltd. (China), UTAC Group (Singapore), ChipMOS Technology (Taiwan), Chipbond Technology Corporation (Taiwan) and MICROSS STS (United States) etc.
A semiconductor package is a metal, plastic, glass or ceramic casing containing one or more semiconductor electronic components. Semiconductor packaging technology has evolved to minimize the costs involved and enhance the overall efficacy of ICs. The market players in the market are under constant pressure to deliver innovative solutions in terms of the size of the packaging, performance, and the “time-to-market” aspect.

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