What is Thermal Gap Filler?
Thermal gap fillers, offer good thermal properties, and also the possibility of compensating for small, medium or large distances between the components (hot spots) and the heat sinks, thus reducing thermal resistance. This protects the components from overheating. These thermal fillers are used for heat dissipation in electronic components. They work with heat sinks or metal cases to dissipate heat from critical electronic parts. These fillers are non-adhesive curing silicones and form a soft, stress-absorbing interface and fill uneven areas to develop cooling. Thermal Gap Filler materials can conform to highly intricate features and multi-level surfaces, delivering better wet-out for enhanced thermal resistance that is usually lower than more solid pad-based mediums. Application volume and pattern is completely adaptable.
The market study is broken down by Type (Thermal Filler Pads [Conductive Pads, Interface Pads] and Thermal Filler Gel) and major geographies with country level break-up.
The companies are exploring the market by adopting mergers & acquisitions, expansions, investments, new service launches and collaborations as their preferred strategies. The players are exploring new geographies through expansions and acquisitions to avail a competitive advantage through combined synergies. Analysts at AMA Research estimates that Manufacturers from United States will contribute to the maximum growth of Global Thermal Gap Filler market throughout the predicted period. Established and emerging Manufacturers should take a closer view at their existing organizations and reinvent traditional business and operating models to adapt to the future.
Honeywell International Inc. (United States), 3M Company (United States), Dow Corning Corporation (United States), MTC Micro Tech Components GmbH (Germany), Timtronics (United States), Laird Technologie (China), Semikron (Germany), Indium Corporation (United States), Wakefield-Vette, Inc. (United States), Parker Hannifin Corporation (United States), Fujipoly (United States), Boyd Corporation (United States) and Henkel AG & Co. KGaA (Germany) are some of the key players that are part of study coverage. Additionally, the Manufacturers which are also part of the research coverage are Momentive (United States), Stockwell Elastomerics, Inc. (United States), HITEK Electronic Materials Ltd. (United Kingdom) and OSCO (United Kingdom).
Segmentation Overview
AdvanceMarketAnalytics has segmented the market of Global Thermal Gap Filler market by Type, Application and Region.
On the basis of geography, the market of Thermal Gap Filler has been segmented into South America (Brazil, Argentina, Rest of South America), Asia Pacific (China, Japan, India, South Korea, Taiwan, Australia, Rest of Asia-Pacific), Europe (Germany, France, Italy, United Kingdom, Netherlands, Rest of Europe), MEA (Middle East, Africa), North America (United States, Canada, Mexico). If we see Market by Conductivity, the sub-segment i.e. Up to 0.3 W/m-k will boost the Thermal Gap Filler market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by Material Type, the sub-segment i.e. Silicone Gap Fillers will boost the Thermal Gap Filler market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth. If we see Market by End-Use, the sub-segment i.e. Electronic Components will boost the Thermal Gap Filler market. Additionally, the rising demand from SMEs and various industry verticals gives enough cushion to market growth.
In Apr 2019, Henkel announced the launch of new technology that provide cost eficient large scale assembly and protection for battery architecture. This is silicon free gap filler special defined for elelctric vehicles. Among this latest technology, the companies thermal gap filler for growing demand.
Market Trend
- Advancement in the Technology for Gap Filler
Market Drivers
- Growing Demand for Consumer Electronics
- Increasing Use from End-Use Industry
Opportunities
- High Potential Growth Offered by Developing Regions
Restraints
- Fluctuating Prices of Raw Materials
Challenges
- Availability of Substitutes
Key Target Audience
Manufacturers of Thermal Gap Fillers, Suppliers of Thermal Gap Fillers, Wholesalers, Distributors and Retailers of Thermal Gap Fillers, End-Use Industry and Others
About Approach
To evaluate and validate the market size various sources including primary and secondary analysis is utilized. AMA Research follows regulatory standards such as NAICS/SIC/ICB/TRCB, to have the better understanding of the market. The market study is conducted on basis of more than 200 companies dealing in the market regional as well as global areas with purpose to understand companys positioning regarding market value, volume and their market share for regional as well as global.
Further to bring relevance specific to any niche market we set and apply number of criteria like Geographic Footprints, Regional Segments of Revenue, Operational Centres, etc. The next step is to finalize a team (In-House + Data Agencies) who then starts collecting C & D level executives and profiles, Industry experts, Opinion leaders etc. and work towards appointment generation.
The primary research is performed by taking the interviews of executives of various companies dealing in the market as well as using the survey reports, research institute, and latest research reports. Meanwhile, analyst team keeps preparing set of questionnaires and after getting appointee list; the target audience are then tapped and segregated with various mediums and channels that are feasible for making connection that includes email communication, telephonic, skype, LinkedIn Group & InMail, Community Forums, Community Forums, open Survey, SurveyMonkey etc.